Assignee
CHU TSE-MING
TW·1 granted patent·2 pending applications·0 citations·filing 2007–2012
Top patents by PatentIndex Score
3 records- 0133US2010133686A1Chip package structureCHU TSE-MING·Filed 2009·Application pending·0 cites
- 0228US8937386B2Chip package structure with ENIG platingCHU TSE-MING·Filed 2012·Granted Jan 20, 2015·0 cites·6 claims
- 0324US2010244200A1Integrated circuit connecting structure having flexible layoutCHU TSE MING·Filed 2007·Application pending·0 cites
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