Assignee
CHUA LINDA PEI EE
SG·2 granted patents·65 citations·filing 2010–2011
Top patents by PatentIndex Score
2 records- 0197US8558392B2Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulantCHUA LINDA PEI EE·Filed 2010·Granted Oct 15, 2013·65 cites·45 claims
- 0242US8466057B2Integrated circuit packaging system with filled vias and method of manufacture thereofCHUA LINDA PEI EE·Filed 2011·Granted Jun 18, 2013·0 cites·20 claims
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