Assignee
CO TECH DEV CORP
TW·8 granted patents·1 pending application·5 citations·filing 2019–2024
Top patents by PatentIndex Score
9 records- 0185US11053602B2Micro-roughened electrodeposited copper foil and copper foil substrateCO TECH DEV CORP·Filed 2019·Granted Jul 6, 2021·2 cites·12 claims
- 0284US12120816B2Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2021·Granted Oct 15, 2024·1 cites·9 claims
- 0383US12557213B2Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2024·Granted Feb 17, 2026·0 cites·12 claims
- 0481US11047061B2Micro-roughened electrodeposited copper foil and copper foil substrateCO TECH DEV CORP·Filed 2019·Granted Jun 29, 2021·2 cites·12 claims
- 0562US2020404784A1Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2020·Application pending·0 cites
- 0659US11186918B2Micro-roughened electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2019·Granted Nov 30, 2021·0 cites·13 claims
- 0756US11332839B2Advanced electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 0855US11655555B2Advanced reverse treated electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 23, 2023·0 cites·19 claims
- 0953US11408087B2Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
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