Micro-roughened electrodeposited copper foil and copper clad laminate

Abstract

Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-rough surface includes multiple copper nodule-free areas and copper nodule-arranged areas. The micro-rough surface of 120 μm2 has at least five copper nodule-free areas of 62500 nm2 or more. Each copper nodule-arranged area has a length of 300 nm to 2500 nm and includes three to fifty copper nodules with a mean width of 10 nm to 300 nm. Besides, the micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface profile and/or characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

What is claimed is: 
     
         1 . A micro-roughened electrodeposited copper foil, comprising:
 a micro-rough surface, having multiple copper nodule-free areas and multiple copper nodule-arranged areas, in which part of the copper nodule-free areas are dispersed among the copper nodule-arranged areas;   multiple copper nodules, being formed on the micro-rough surface and located in the copper nodule-arranged areas, in which the copper nodules are not located in the copper nodule-free areas, and the copper nodules in each copper nodule-arranged area are arranged and formed along a direction on the micro-rough surface;   wherein, in the micro-rough surface of 120 μm 2 , the number of the copper nodule-free areas is 5 or higher, each copper nodule-free area has a size of 62500 nm 2  or higher, each copper nodule-arranged area has a length of 300 nm to 2500 nm, the copper nodules in each copper nodule-arranged area have a mean width of 10 nm to 300 nm, and the number of the copper nodules in each copper nodule-arranged area is 3 to 50.   
     
     
         2 . The micro-roughened electrodeposited copper foil as claimed in  claim 1 , wherein the number of the copper nodule-free areas is 10 to 100. 
     
     
         3 . The micro-roughened electrodeposited copper foil as claimed in  claim 1 , wherein the size of each copper nodule-free area is 250 nm×250 nm or higher. 
     
     
         4 . The micro-roughened electrodeposited copper foil as claimed in  claim 1 , wherein the size of each copper nodule-free area is 500 nm×250 nm or higher; and, in the micro-rough surface of 120 μm 2 , the number of the copper nodule-free areas having a size of 500 nm×250 nm or higher is 10 to 50. 
     
     
         5 . The micro-roughened electrodeposited copper foil as claimed in  claim 1 , wherein the copper nodules in each copper nodule-arranged area have a mean width of 10 nm to 200 nm. 
     
     
         6 . The micro-roughened electrodeposited copper foil as claimed in  claim 5 , wherein the number of the copper nodules in each copper nodule-arranged area is 3 to 10. 
     
     
         7 . A micro-roughened electrodeposited copper foil comprising a micro-rough surface, wherein the micro-rough surface has an Rlr value of 1.05 to 1.60. 
     
     
         8 . The micro-roughened electrodeposited copper foil as claimed in  claim 7 , wherein the micro-rough surface has an Sdr value of 0.01 to 0.08. 
     
     
         9 . The micro-roughened electrodeposited copper foil as claimed in  claim 7 , wherein the micro-rough surface has an Rlr value of 1.10 to 1.30, and the micro-rough surface has an Sdr value of 0.010 to 0.023. 
     
     
         10 . A micro-roughened electrodeposited copper foil comprising a micro-rough surface, wherein the micro-rough surface has an Sdr value of 0.01 to 0.08. 
     
     
         11 . A copper clad laminate, comprising the micro-roughened electrodeposited copper foil as claimed in  claim 1 , and a substrate; wherein the substrate and the micro-roughened electrodeposited copper foil are laminated. 
     
     
         12 . The copper clad laminate as claimed in  claim 11 , wherein the copper clad laminate has an insertion loss at 4 GHz of −0.26 dB/in to −0.32 dB/in. 
     
     
         13 . The copper clad laminate as claimed in  claim 11 , wherein the copper clad laminate has an insertion loss at 8 GHz of −0.41 dB/in to −0.51 dB/in. 
     
     
         14 . The copper clad laminate as claimed in  claim 11 , wherein the copper clad laminate has an insertion loss at 12.89 GHz of −0.57 dB/in to −0.73 dB/in. 
     
     
         15 . The copper clad laminate as claimed in  claim 11 , wherein the copper clad laminate has an insertion loss at 16 GHz of −0.67 dB/in to −0.83 dB/in. 
     
     
         16 . A copper clad laminate, comprising the micro-roughened electrodeposited copper foil as claimed in  claim 7 , and a substrate; wherein the substrate and the micro-roughened electrodeposited copper foil are laminated. 
     
     
         17 . The copper clad laminate as claimed in  claim 16 , wherein the copper clad laminate has an insertion loss at 4 GHz of −0.26 dB/in to −0.32 dB/in. 
     
     
         18 . The copper clad laminate as claimed in  claim 16 , wherein the copper clad laminate has an insertion loss at 8 GHz of −0.41 dB/in to −0.51 dB/in. 
     
     
         19 . The copper clad laminate as claimed in  claim 16 , wherein the copper clad laminate has an insertion loss at 12.89 GHz of −0.57 dB/in to −0.73 dB/in. 
     
     
         20 . The copper clad laminate as claimed in  claim 16 , wherein the copper clad laminate has an insertion loss at 16 GHz of −0.67 dB/in to −0.83 dB/in. 
     
     
         21 . A copper clad laminate, comprising the micro-roughened electrodeposited copper foil as claimed in  claim 10 , and a substrate; wherein the substrate and the micro-roughened electrodeposited copper foil are laminated. 
     
     
         22 . The copper clad laminate as claimed in  claim 21 , wherein the copper clad laminate has an insertion loss at 4 GHz of −0.26 dB/in to −0.32 dB/in. 
     
     
         23 . The copper clad laminate as claimed in  claim 21 , wherein the copper clad laminate has an insertion loss at 8 GHz of −0.41 dB/in to −0.51 dB/in. 
     
     
         24 . The copper clad laminate as claimed in  claim 21 , wherein the copper clad laminate has an insertion loss at 12.89 GHz of −0.57 dB/in to −0.73 dB/in. 
     
     
         25 . The copper clad laminate as claimed in  claim 21 , wherein the copper clad laminate has an insertion loss at 16 GHz of −0.67 dB/in to −0.83 dB/in.