Inventor · disambiguated record
Yun-Hsing Sung
Also filed as: SUNG YUN-HSING
7 granted patents·4 pending applications·5 citations·filing 2013–2024
74Inventor score
Top patents by PatentIndex Score
11 records- 0185US11053602B2Micro-roughened electrodeposited copper foil and copper foil substrateCO TECH DEV CORP·Filed 2019·Granted Jul 6, 2021·2 cites·12 claims
- 0284US12120816B2Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2021·Granted Oct 15, 2024·1 cites·9 claims
- 0381US11047061B2Micro-roughened electrodeposited copper foil and copper foil substrateCO TECH DEV CORP·Filed 2019·Granted Jun 29, 2021·2 cites·12 claims
- 0462US2020404784A1Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2020·Application pending·0 cites
- 0559US11186918B2Micro-roughened electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2019·Granted Nov 30, 2021·0 cites·13 claims
- 0657US2025365860A1Copper-clad laminate and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0756US11332839B2Advanced electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 0855US11655555B2Advanced reverse treated electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 23, 2023·0 cites·19 claims
- 0953US11408087B2Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
- 1052US2025056720A1Copper clad laminate and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1136US2014093722A1Electromagnetic interference shielding structureITEQ CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →