Inventor · disambiguated record
Hung-Wei Hsu
Also filed as: HSU HUNG-WEI
9 granted patents·3 pending applications·37 citations·filing 2010–2021
83Inventor score
Top patents by PatentIndex Score
12 records- 0189US9634432B2High frequency connector with enhanced grounding for reduced crosstalkNEXTRONICS ENGINEERING CORP·Filed 2015·Granted Apr 25, 2017·13 cites·7 claims
- 0285US9774143B1High frequency signal communication connector with improved crosstalk performanceNEXTRONICS ENGINEERING CORP·Filed 2016·Granted Sep 26, 2017·11 cites·10 claims
- 0384US12120816B2Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2021·Granted Oct 15, 2024·1 cites·9 claims
- 0478US10074941B1High-speed connector and connector assemblyNEXTRONICS ENGINEERING CORP·Filed 2018·Granted Sep 11, 2018·6 cites·18 claims
- 0573US9520678B2Signal transmission connectorNEXTRONICS ENGINEERING CORP·Filed 2015·Granted Dec 13, 2016·5 cites·3 claims
- 0662US2020404784A1Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2020·Application pending·0 cites
- 0758US9323016B2Bi-directional data transmission method, high-frequency connector and optical connector using the sameNEXTRONICS ENGINEERING CORP·Filed 2013·Granted Apr 26, 2016·1 cites·18 claims
- 0856US11332839B2Advanced electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 0955US11655555B2Advanced reverse treated electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 23, 2023·0 cites·19 claims
- 1053US11408087B2Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
- 1139US2011159171A1Method for preparing organic light emitting diode and device thereofUNIV NAT CHIAO TUNG·Filed 2010·Application pending·0 cites
- 1234US2015155665A1Signal transmission connectorNEXTRONICS ENGINEERING CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →