Inventor · disambiguated record
Shih-Shen Lee
Also filed as: LEE SHIH-SHEN
4 granted patents·1 pending application·1 citations·filing 2020–2021
57Inventor score
Files withCO TECH DEV CORP5
Top patents by PatentIndex Score
5 records- 0184US12120816B2Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2021·Granted Oct 15, 2024·1 cites·9 claims
- 0262US2020404784A1Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2020·Application pending·0 cites
- 0356US11332839B2Advanced electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 0455US11655555B2Advanced reverse treated electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 23, 2023·0 cites·19 claims
- 0553US11408087B2Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →