Assignee
CO TECH DEV CORP
TW·8 granted patents·1 pending application·5 citations·filing 2019–2024
Top patents by PatentIndex Score
9 records- 0185US11053602B2Micro-roughened electrodeposited copper foil and copper foil substrateCO TECH DEV CORP·Filed 2019·Granted Jul 6, 2021·2 cites·12 claims
- 0284US12120816B2Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2021·Granted Oct 15, 2024·1 cites·9 claims
- 0383US12557213B2Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2024·Granted Feb 17, 2026·0 cites·12 claims
- 0481US11047061B2Micro-roughened electrodeposited copper foil and copper foil substrateCO TECH DEV CORP·Filed 2019·Granted Jun 29, 2021·2 cites·12 claims
- 0562US2020404784A1Micro-roughened electrodeposited copper foil and copper clad laminateCO TECH DEV CORP·Filed 2020·Application pending·0 cites
- 0659US11186918B2Micro-roughened electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2019·Granted Nov 30, 2021·0 cites·13 claims
- 0756US11332839B2Advanced electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 0855US11655555B2Advanced reverse treated electrodeposited copper foil and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted May 23, 2023·0 cites·19 claims
- 0953US11408087B2Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the sameCO TECH DEV CORP·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →