Assignee
DISCO CORP
JP1,494 patents
Top patents by PatentIndex Score
US6465158B1Oct 15, 2002
Semiconductor wafer dividing method
DISCO CORP149 citations99
US6344402B1Feb 5, 2002
Method of dicing workpiece
DISCO CORP149 citations99
US7507639B2Mar 24, 2009
Wafer dividing method
DISCO CORP117 citations98
US7435607B2Oct 14, 2008
Method of wafer laser processing using a gas permeable protective tape
DISCO CORP113 citations98
US7364986B2Apr 29, 2008
Laser beam processing method and laser beam machine
DISCO CORP121 citations98
US6998571B2Feb 14, 2006
Laser beam processing machine
DISCO CORP137 citations98
US6803247B2Oct 12, 2004
Method for dividing semiconductor wafer
DISCO CORP135 citations98
US6528864B1Mar 4, 2003
Semiconductor wafer having regular or irregular chip pattern and dicing method for the same
DISCO CORP180 citations98
US7468309B2Dec 23, 2008
Semiconductor wafer treatment method
DISCO CORP114 citations97
US7265033B2Sep 4, 2007
Laser beam processing method for a semiconductor wafer
DISCO CORP138 citations97
US7179723B2Feb 20, 2007
Wafer processing method
DISCO CORP138 citations97
US7473866B2Jan 6, 2009
Laser processing apparatus
DISCO CORP124 citations96
US7129150B2Oct 31, 2006
Method of dividing a semiconductor wafer
DISCO CORP139 citations95
US10155323B2Dec 18, 2018
SiC wafer producing method
DISCO CORP22 citations94
US9925619B2Mar 27, 2018
Wafer producing method
DISCO CORP23 citations94
US9878397B2Jan 30, 2018
SiC wafer producing method
DISCO CORP50 citations94
US9868177B2Jan 16, 2018
Wafer producing method
DISCO CORP36 citations94
US9815138B2Nov 14, 2017
Wafer producing method
DISCO CORP26 citations94
US9789565B2Oct 17, 2017
Wafer producing method
DISCO CORP28 citations94
US9620415B2Apr 11, 2017
Wafer processing method
DISCO CORP49 citations94
US9517530B2Dec 13, 2016
Wafer producing method
DISCO CORP31 citations94
US9481051B2Nov 1, 2016
Wafer producing method
DISCO CORP48 citations94
US7559826B2Jul 14, 2009
Processing method and grinding apparatus of wafer
DISCO CORP20 citations93
US7402773B2Jul 22, 2008
Laser beam processing machine
DISCO CORP33 citations93
US6102023AAug 15, 2000
Precision cutting apparatus and cutting method using the same
DISCO CORP72 citations93
US7462094B2Dec 9, 2008
Wafer grinding method
DISCO CORP25 citations92
US7164961B2Jan 16, 2007
Modified photolithography movement system
DISCO CORP20 citations92
US7115485B2Oct 3, 2006
Method for processing wafer
DISCO CORP20 citations92
US6939785B2Sep 6, 2005
Process for manufacturing a semiconductor chip
DISCO CORP25 citations92
US6726526B2Apr 27, 2004
Cutting machine
DISCO CORP22 citations92
US6527627B2Mar 4, 2003
Semiconductor wafer grinding method
DISCO CORP26 citations92
US6386466B1May 14, 2002
Cleaning apparatus
DISCO CORP80 citations92
US6382609B1May 7, 2002
Chuck table
DISCO CORP20 citations92
US7915140B2Mar 29, 2011
Fabrication method for device having die attach film on the back side thereof
DISCO CORP22 citations91
US7544588B2Jun 9, 2009
Laser processing method for wafer
DISCO CORP21 citations91
US6852608B2Feb 8, 2005
Production method for semiconductor chip
DISCO CORP25 citations91
US6010396AJan 4, 2000
Blade cover in a cutting apparatus
DISCO CORP22 citations91
US6939741B2Sep 6, 2005
IC chip manufacturing method
DISCO CORP22 citations90
US6676491B2Jan 13, 2004
Semiconductor wafer dividing method
DISCO CORP30 citations90
US6386191B1May 14, 2002
CSP plate holder
DISCO CORP25 citations90
US6345616B1Feb 12, 2002
Cutting machine
DISCO CORP45 citations90
US6448151B2Sep 10, 2002
Process for producing a large number of semiconductor chips from a semiconductor wafer
DISCO CORP40 citations89
US6361404B1Mar 26, 2002
Precision cutting apparatus and cutting method using the same
DISCO CORP22 citations89
US6685542B2Feb 3, 2004
Grinding machine
DISCO CORP24 citations88
US6609965B2Aug 26, 2003
Cutting blade
DISCO CORP21 citations88
US6428393B1Aug 6, 2002
Method of providing semiconductor wafers each having a plurality of bumps exposed from its resin coating
DISCO CORP34 citations88
US6341600B1Jan 29, 2002
Mechanism for adjusting rotational balance of cutting machine
DISCO CORP31 citations88
US7022000B2Apr 4, 2006
Wafer processing machine
DISCO CORP27 citations87
US6498075B1Dec 24, 2002
Dicing method
DISCO CORP22 citations87
US6454517B1Sep 24, 2002
Wafer carrier device
DISCO CORP21 citations87
Showing the top 50 of 1,494 patents by PatentIndex Score.