Assignee
DISCO CORP
JP·1,494 granted patents·626 pending applications·5,881 citations·filing 1997–2025
Top patents by PatentIndex Score
2,120 records- 0199US12288682B2Processing method of waferDISCO CORP·Filed 2022·Granted Apr 29, 2025·8 cites·15 claims
- 0299US11958132B2SiC ingot processing method and laser processing apparatusDISCO CORP·Filed 2020·Granted Apr 16, 2024·10 cites·3 claims
- 0399US11819950B2Edge position detecting apparatusDISCO CORP·Filed 2021·Granted Nov 21, 2023·11 cites·14 claims
- 0499US11590630B2Workpiece grinding methodDISCO CORP·Filed 2021·Granted Feb 28, 2023·4 cites·2 claims
- 0599US9878397B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Jan 30, 2018·50 cites·3 claims
- 0699US9868177B2Wafer producing methodDISCO CORP·Filed 2017·Granted Jan 16, 2018·36 cites·1 claims
- 0799US9815138B2Wafer producing methodDISCO CORP·Filed 2016·Granted Nov 14, 2017·26 cites·4 claims
- 0898US12151401B2Edge alignment methodDISCO CORP·Filed 2021·Granted Nov 26, 2024·10 cites·3 claims
- 0998US11858090B2Grinding apparatus and method of driving grinding apparatusDISCO CORP·Filed 2021·Granted Jan 2, 2024·2 cites·12 claims
- 1098US10406635B2Wafer producing method and processing feed direction detecting methodDISCO CORP·Filed 2017·Granted Sep 10, 2019·13 cites·2 claims
- 1198US9789565B2Wafer producing methodDISCO CORP·Filed 2015·Granted Oct 17, 2017·28 cites·2 claims
- 1298US9620415B2Wafer processing methodDISCO CORP·Filed 2016·Granted Apr 11, 2017·49 cites·4 claims
- 1398US9481051B2Wafer producing methodDISCO CORP·Filed 2016·Granted Nov 1, 2016·48 cites·3 claims
- 1498US7507639B2Wafer dividing methodDISCO CORP·Filed 2006·Granted Mar 24, 2009·117 cites·2 claims
- 1598US7435607B2Method of wafer laser processing using a gas permeable protective tapeDISCO CORP·Filed 2005·Granted Oct 14, 2008·113 cites·3 claims
- 1697US12109667B2Spindle unit and processing apparatusDISCO CORP·Filed 2021·Granted Oct 8, 2024·2 cites·12 claims
- 1797US11538704B2Processing method of workpieceDISCO CORP·Filed 2020·Granted Dec 27, 2022·6 cites·9 claims
- 1897US11276588B2Method of processing waferDISCO CORP·Filed 2020·Granted Mar 15, 2022·4 cites·5 claims
- 1997US11222822B2Workpiece cutting methodDISCO CORP·Filed 2020·Granted Jan 11, 2022·10 cites·16 claims
- 2097US10155323B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Dec 18, 2018·22 cites·6 claims
- 2197US9517530B2Wafer producing methodDISCO CORP·Filed 2016·Granted Dec 13, 2016·31 cites·1 claims
- 2297US7473866B2Laser processing apparatusDISCO CORP·Filed 2006·Granted Jan 6, 2009·124 cites·3 claims
- 2397US7468309B2Semiconductor wafer treatment methodDISCO CORP·Filed 2006·Granted Dec 23, 2008·114 cites·4 claims
- 2497US7402773B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Jul 22, 2008·33 cites·5 claims
- 2597US6998571B2Laser beam processing machineDISCO CORP·Filed 2004·Granted Feb 14, 2006·137 cites·5 claims
- 2697US6528864B1Semiconductor wafer having regular or irregular chip pattern and dicing method for the sameDISCO CORP·Filed 2000·Granted Mar 4, 2003·180 cites·3 claims
- 2797US6465158B1Semiconductor wafer dividing methodDISCO CORP·Filed 2000·Granted Oct 15, 2002·149 cites·5 claims
- 2897US6344402B1Method of dicing workpieceDISCO CORP·Filed 2000·Granted Feb 5, 2002·149 cites·3 claims
- 2996US12191138B2Processing method of workpieceDISCO CORP·Filed 2021·Granted Jan 7, 2025·8 cites·10 claims
- 3096US11201126B2Method of producing a substrate and system for producing a substrateDISCO CORP·Filed 2020·Granted Dec 14, 2021·4 cites·12 claims
- 3196US10870176B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Dec 22, 2020·16 cites·2 claims
- 3296US9925619B2Wafer producing methodDISCO CORP·Filed 2016·Granted Mar 27, 2018·23 cites·3 claims
- 3396US9808884B2Polycrystalline SiC wafer producing methodDISCO CORP·Filed 2016·Granted Nov 7, 2017·16 cites·4 claims
- 3496US7364986B2Laser beam processing method and laser beam machineDISCO CORP·Filed 2004·Granted Apr 29, 2008·121 cites·5 claims
- 3596US7179723B2Wafer processing methodDISCO CORP·Filed 2004·Granted Feb 20, 2007·138 cites·7 claims
- 3696US6803247B2Method for dividing semiconductor waferDISCO CORP·Filed 2003·Granted Oct 12, 2004·135 cites·5 claims
- 3795US11717927B2Workpiece grinding methodDISCO CORP·Filed 2022·Granted Aug 8, 2023·2 cites·2 claims
- 3895US11651988B2Processing apparatusDISCO CORP·Filed 2022·Granted May 16, 2023·3 cites·3 claims
- 3995US10357851B2Wafer producing methodDISCO CORP·Filed 2017·Granted Jul 23, 2019·15 cites·2 claims
- 4095US9764420B2Wafer producing methodDISCO CORP·Filed 2015·Granted Sep 19, 2017·14 cites·2 claims
- 4195US9764428B2Wafer producing methodDISCO CORP·Filed 2015·Granted Sep 19, 2017·15 cites·2 claims
- 4295US9349647B2Cutting methodDISCO CORP·Filed 2015·Granted May 24, 2016·12 cites·3 claims
- 4395US7462094B2Wafer grinding methodDISCO CORP·Filed 2007·Granted Dec 9, 2008·25 cites·2 claims
- 4495US7265033B2Laser beam processing method for a semiconductor waferDISCO CORP·Filed 2004·Granted Sep 4, 2007·138 cites·2 claims
- 4594US12094742B2Processing apparatusDISCO CORP·Filed 2021·Granted Sep 17, 2024·3 cites·10 claims
- 4694US11980993B2Method of grinding workpieceDISCO CORP·Filed 2022·Granted May 14, 2024·2 cites·12 claims
- 4794US11935778B2Holding mechanism including Bernoulli padDISCO CORP·Filed 2021·Granted Mar 19, 2024·3 cites·3 claims
- 4894US10964571B2Conveyance systemDISCO CORP·Filed 2020·Granted Mar 30, 2021·3 cites·4 claims
- 4994US10668595B2Method of using laminated dressing boardDISCO CORP·Filed 2018·Granted Jun 2, 2020·5 cites·8 claims
- 5094US10201907B2SiC wafer producting methodDISCO CORP·Filed 2017·Granted Feb 12, 2019·12 cites·6 claims
Showing the top 50 of 2,120 patent records by PatentIndex Score.
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