Assignee
DUNNE RAJIV
US·4 granted patents·46 citations·filing 2009–2012
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0193US8313982B2Stacked die assemblies including TSV dieDUNNE RAJIV·Filed 2010·Granted Nov 20, 2012·24 cites·17 claims
- 0290US8178976B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2009·Granted May 15, 2012·18 cites·14 claims
- 0379US8431481B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2012·Granted Apr 30, 2013·4 cites·11 claims
- 0452US8436475B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2012·Granted May 7, 2013·0 cites·10 claims
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