Assignee
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US86 patents
Top patents by PatentIndex Score
US6860925B2Mar 1, 2005
Printed circuit board manufacture
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Copper metallization of through silicon via
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US4395302AJul 26, 1983
Metal dissolution process using H2 O2 --H2 SO4 etchant
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Anti-tarnish coatings
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Defectivity and process control of electroless deposition in microelectronics applications
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Defect reduction in electrodeposited copper for semiconductor applications
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Copper electrodeposition in microelectronics
ENTHONE29 citations91
US7232478B2Jun 19, 2007
Adhesion promotion in printed circuit boards
ENTHONE16 citations90
US4840820AJun 20, 1989
Electroless nickel plating of aluminum
ENTHONE41 citations90
US4567066AJan 28, 1986
Electroless nickel plating of aluminum
ENTHONE30 citations90
US6776893B1Aug 17, 2004
Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
ENTHONE53 citations89
US6375866B1Apr 23, 2002
Method for applying a conductive paint coating and articles made thereby
ENTHONE40 citations89
US5141778AAug 25, 1992
Method of preparing aluminum memory disks having a smooth metal plated finish
ENTHONE29 citations89
US4746369AMay 24, 1988
Peroxide selective stripping compositions and method
ENTHONE27 citations89
US4663240AMay 5, 1987
RFI shielded plastic articles and process for making same
ENTHONE68 citations89
US4629636ADec 16, 1986
Process for treating plastics with alkaline permanganate solutions
ENTHONE38 citations89
US4592852AJun 3, 1986
Composition and process for treating plastics with alkaline permanganate solutions
ENTHONE50 citations89
US4554049ANov 19, 1985
Selective nickel stripping compositions and method of stripping
ENTHONE40 citations89
US4514586AApr 30, 1985
Method of using a shielding means to attenuate electromagnetic radiation in the radio frequency range
ENTHONE73 citations89
US6524644B1Feb 25, 2003
Process for selective deposition of OSP coating on copper, excluding deposition on gold
ENTHONE31 citations88
US4302246ANov 24, 1981
Solution and method for selectively stripping alloys containing nickel with gold, phosphorous or chromium from stainless steel and related nickel base alloys
ENTHONE37 citations88
US4948630AAug 14, 1990
Three step process for treating plastics with alkaline permanganate solutions
ENTHONE39 citations86
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Three step process for treating plastics with alkaline permanganate solutions
ENTHONE25 citations86
US4775557AOct 4, 1988
Composition and process for conditioning the surface of polycarbonate resins prior to metal plating
ENTHONE30 citations86
US4004956AJan 25, 1977
Selectively stripping tin or tin-lead alloys from copper substrates
ENTHONE33 citations86
US6821323B1Nov 23, 2004
Process for the non-galvanic tin plating of copper or copper alloys
ENTHONE24 citations85
US8771495B2Jul 8, 2014
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
ENTHONE8 citations84
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Surface preparation process for damascene copper deposition
ENTHONE16 citations84
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Copper deposition for filling features in manufacture of microelectronic devices
ENTHONE11 citations84
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Process and electrolytes for deposition of metal layers
ENTHONE27 citations84
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Capping of metal interconnects in integrated circuit electronic devices
ENTHONE10 citations84
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Metallic surface enhancement
ENTHONE7 citations83
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Cobalt and nickel electroless plating in microelectronic devices
ENTHONE16 citations83
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Process for metallizing a plastic surface
ENTHONE25 citations83
US4956097ASep 11, 1990
Waste treatment of metal containing solutions
ENTHONE22 citations81
US4512856AApr 23, 1985
Zinc plating solutions and method utilizing ethoxylated/propoxylated polyhydric alcohols
ENTHONE26 citations81
US5032426AJul 16, 1991
Method and apparatus for applying liquid coatings on the surface of printed circuit boards
ENTHONE26 citations80
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Process for treating plastics with alkaline permanganate solutions
ENTHONE22 citations80
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Tin-silver solder bumping in electronics manufacture
ENTHONE12 citations79
US7578888B2Aug 25, 2009
Method for treating laser-structured plastic surfaces
ENTHONE14 citations79
US4717439AJan 5, 1988
Process for the treatment of copper oxide in the preparation of printed circuit boards
ENTHONE23 citations79
US4608091AAug 26, 1986
Peroxide selective stripping compositions and method
ENTHONE23 citations79
US6837981B2Jan 4, 2005
Chromium alloy coating and a method and electrolyte for the deposition thereof
ENTHONE14 citations78
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Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
ENTHONE17 citations75
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Organic solderability preservative comprising high boiling temperature alcohol
ENTHONE7 citations73
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Capping of metal interconnects in integrated circuit electronic devices
ENTHONE9 citations73
US4600699AJul 15, 1986
Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters
ENTHONE18 citations73
US4304646ADec 8, 1981
Method for selective removal of copper contaminants from activator solutions containing palladium and tin
ENTHONE10 citations73
US7815786B2Oct 19, 2010
Copper electrodeposition in microelectronics
ENTHONE6 citations72
US7615491B2Nov 10, 2009
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE4 citations72
Showing the top 50 of 86 patents by PatentIndex Score.