Individual holder
FAROOQ MUKTA G
US·47 granted patents·2 pending applications·1,143 citations·filing 2006–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
49 records- 0199US8841777B2Bonded structure employing metal semiconductor alloy bondingFAROOQ MUKTA G·Filed 2010·Granted Sep 23, 2014·216 cites·16 claims
- 0299US8563403B1Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation lastFAROOQ MUKTA G·Filed 2012·Granted Oct 22, 2013·184 cites·20 claims
- 0399US8158515B2Method of making 3D integrated circuitsFAROOQ MUKTA G·Filed 2010·Granted Apr 17, 2012·281 cites·14 claims
- 0499US8129256B23D integrated circuit device fabrication with precisely controllable substrate removalFAROOQ MUKTA G·Filed 2008·Granted Mar 6, 2012·254 cites·18 claims
- 0595US8492878B2Metal-contamination-free through-substrate via structureFAROOQ MUKTA G·Filed 2010·Granted Jul 23, 2013·21 cites·24 claims
- 0692US8791009B2Method of forming a through-silicon via utilizing a metal contact pad in a back-end-of-line wiring level to fill the through-silicon viaFAROOQ MUKTA G·Filed 2011·Granted Jul 29, 2014·11 cites·9 claims
- 0792US8748288B2Bonded structure with enhanced adhesion strengthFAROOQ MUKTA G·Filed 2010·Granted Jun 10, 2014·12 cites·12 claims
- 0892US8120175B2Soft error rate mitigation by interconnect structureFAROOQ MUKTA G·Filed 2007·Granted Feb 21, 2012·23 cites·8 claims
- 0991US8674515B23D integrated circuits structureFAROOQ MUKTA G·Filed 2012·Granted Mar 18, 2014·11 cites·11 claims
- 1089US9406561B2Three dimensional integrated circuit integration using dielectric bonding first and through via formation lastFAROOQ MUKTA G·Filed 2009·Granted Aug 2, 2016·19 cites·27 claims
- 1189US8859390B2Structure and method for making crack stop for 3D integrated circuitsFAROOQ MUKTA G·Filed 2010·Granted Oct 14, 2014·9 cites·10 claims
- 1288US8691691B2TSV pillar as an interconnecting structureFAROOQ MUKTA G·Filed 2011·Granted Apr 8, 2014·10 cites·16 claims
- 1387US8546961B2Alignment marks to enable 3D integrationFAROOQ MUKTA G·Filed 2011·Granted Oct 1, 2013·9 cites·19 claims
- 1487US8114707B2Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chipFAROOQ MUKTA G·Filed 2010·Granted Feb 14, 2012·8 cites·20 claims
- 1586US8492869B23D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layerFAROOQ MUKTA G·Filed 2012·Granted Jul 23, 2013·5 cites·20 claims
- 1684US8298914B23D integrated circuit device fabrication using interface wafer as permanent carrierFAROOQ MUKTA G·Filed 2008·Granted Oct 30, 2012·7 cites·10 claims
- 1783US8610283B2Semiconductor device having a copper plugFAROOQ MUKTA G·Filed 2009·Granted Dec 17, 2013·7 cites·12 claims
- 1882US9214435B2Via structure for three-dimensional circuit integrationFAROOQ MUKTA G·Filed 2012·Granted Dec 15, 2015·5 cites·17 claims
- 1982US8956973B2Bottom-up plating of through-substrate viasFAROOQ MUKTA G·Filed 2012·Granted Feb 17, 2015·5 cites·9 claims
- 2082US8853857B23-D integration using multi stage viasFAROOQ MUKTA G·Filed 2011·Granted Oct 7, 2014·5 cites·11 claims
- 2180US8492252B2Three dimensional integration and methods of through silicon via creationFAROOQ MUKTA G·Filed 2012·Granted Jul 23, 2013·3 cites·6 claims
- 2278US8791005B2Sidewalls of electroplated copper interconnectsFAROOQ MUKTA G·Filed 2012·Granted Jul 29, 2014·3 cites·8 claims
- 2378US8415238B2Three dimensional integration and methods of through silicon via creationFAROOQ MUKTA G·Filed 2010·Granted Apr 9, 2013·3 cites·4 claims
- 2475US8664081B2Method for fabricating 3D integrated circuit device using interface wafer as permanent carrierFAROOQ MUKTA G·Filed 2012·Granted Mar 4, 2014·2 cites·20 claims
- 2574US8569154B2Three dimensional integration and methods of through silicon via creationFAROOQ MUKTA G·Filed 2012·Granted Oct 29, 2013·2 cites·7 claims
- 2674US8287980B2Edge protection seal for bonded substratesFAROOQ MUKTA G·Filed 2009·Granted Oct 16, 2012·3 cites·22 claims
- 2773US8563423B2Fluorine depleted adhesion layer for metal interconnect structureFAROOQ MUKTA G·Filed 2011·Granted Oct 22, 2013·2 cites·11 claims
- 2873US8399180B2Three dimensional integration with through silicon vias having multiple diametersFAROOQ MUKTA G·Filed 2010·Granted Mar 19, 2013·3 cites·11 claims
- 2973US8237288B1Enhanced electromigration resistance in TSV structure and designFAROOQ MUKTA G·Filed 2011·Granted Aug 7, 2012·3 cites·7 claims
- 3070US8613996B2Polymeric edge seal for bonded substratesFAROOQ MUKTA G·Filed 2009·Granted Dec 24, 2013·3 cites·17 claims
- 3169US10784200B2Ionizing radiation blocking in IC chip to reduce soft errorsFAROOQ MUKTA G·Filed 2012·Granted Sep 22, 2020·2 cites·15 claims
- 3269US8399336B2Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layerFAROOQ MUKTA G·Filed 2008·Granted Mar 19, 2013·2 cites·20 claims
- 3369US8288270B2Enhanced electromigration resistance in TSV structure and designFAROOQ MUKTA G·Filed 2012·Granted Oct 16, 2012·2 cites·7 claims
- 3466US8128868B2Grain refinement by precipitate formation in PB-free alloys of tinFAROOQ MUKTA G·Filed 2009·Granted Mar 6, 2012·2 cites·20 claims
- 3564US9059175B2Forming BEOL line fuse structureFAROOQ MUKTA G·Filed 2011·Granted Jun 16, 2015·1 cites·8 claims
- 3664US8999764B2Ionizing radiation blocking in IC chip to reduce soft errorsFAROOQ MUKTA G·Filed 2007·Granted Apr 7, 2015·2 cites·15 claims
- 3764US8629553B23D integrated circuit device fabrication with precisely controllable substrate removalFAROOQ MUKTA G·Filed 2012·Granted Jan 14, 2014·1 cites·20 claims
- 3863US9219023B23D chip stack having encapsulated chip-in-chipFAROOQ MUKTA G·Filed 2010·Granted Dec 22, 2015·1 cites·17 claims
- 3963US8455270B23D multiple die stackingFAROOQ MUKTA G·Filed 2009·Granted Jun 4, 2013·1 cites·16 claims
- 4055US8962448B2Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrierFAROOQ MUKTA G·Filed 2012·Granted Feb 24, 2015·0 cites·20 claims
- 4155US8679611B2Edge protection seal for bonded substratesFAROOQ MUKTA G·Filed 2012·Granted Mar 25, 2014·0 cites·20 claims
- 4254US8749059B2Semiconductor device having a copper plugFAROOQ MUKTA G·Filed 2012·Granted Jun 10, 2014·0 cites·7 claims
- 4353US8738167B23D integrated circuit device fabrication with precisely controllable substrate removalFAROOQ MUKTA G·Filed 2012·Granted May 27, 2014·0 cites·19 claims
- 4452US8461695B2Grain refinement by precipitate formation in Pb-free alloys of tinFAROOQ MUKTA G·Filed 2012·Granted Jun 11, 2013·0 cites·7 claims
- 4551US8970041B2Co-axial restraint for connectors within flip-chip packagesFAROOQ MUKTA G·Filed 2012·Granted Mar 3, 2015·0 cites·9 claims
- 4651US8445374B2Soft error rate mitigation by interconnect structureFAROOQ MUKTA G·Filed 2012·Granted May 21, 2013·0 cites·15 claims
- 4749US2007252288A1Semiconductor module and method for forming the sameFAROOQ MUKTA G·Filed 2007·Application pending·0 cites
- 4848US8507325B2Co-axial restraint for connectors within flip-chip packagesFAROOQ MUKTA G·Filed 2010·Granted Aug 13, 2013·0 cites·11 claims
- 4942US2008029898A1Via stack structuresFAROOQ MUKTA G·Filed 2006·Application pending·0 cites
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