Semiconductor module and method for forming the same

Abstract

Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.

1 . A temporary chip attachment structure, comprising: 
 a semiconductor chip;    a substrate;    an interposer structure electrically connecting the semiconductor chip to the substrate, wherein the interposer structure includes metallurgical through connections having a predetermined shape; and    a chip pick and place head adapted to one of pick up or place the semiconductor chip.    
   
   
       2 . The temporary chip attachment structure of  claim 1 , the chip pick and place head further comprising a vacuum system for picking up the semiconductor chip.  
   
   
       3 . The temporary chip attachment structure of  claim 2 , the vacuum system further comprising a porous surface on a side of the head adjacent the semiconductor chip.  
   
   
       4 . The temporary chip attachment structure of  claim 1 , the chip pick and place head further comprising a cooling system configured to cool the head.  
   
   
       5 . A temporary chip attachment structure, comprising: 
 a semiconductor chip having an under bump metallization;    a substrate having a top surface metallization;    an interposer structure electrically connecting the under bump metallization to the top surface metallization, wherein the interposer structure comprises an elastomeric, compliant material that includes metallurgical through connections having a predetermined shape; and    a chip pick and place head including a vacuum chip pick-up.    
   
   
       6 . The temporary chip attachment structure of  claim 5 , the vacuum chip pick-up further comprising a porous surface on a side of the head adjacent the semiconductor chip.  
   
   
       7 . The temporary chip attachment structure of  claim 5 , the chip pick and place head further comprising a cooling system configured to cool the head.  
   
   
       8 . A method for attaching a semiconductor module, comprising: 
 providing embedded metallurgical through connections within an elastomeric, compliant material to form an interposer structure;    positioning the interposer structure between a semiconductor chip and a substrate to electrically connect the semiconductor chip to the substrate;    providing a chip pick and place head; and    attaching the chip pick and place head to the semiconductor chip.    
   
   
       9 . The method of  claim 8 , the attaching further comprising using a vacuum system for picking up the semiconductor chip.  
   
   
       10 . The method of  claim 9 , the vacuum system further comprising a porous surface on a side of the head adjacent the semiconductor chip.  
   
   
       11 . The method of  claim 8 , the chip pick and place head further comprising a cooling system configured to cool the head.