Inventor · disambiguated record
John U. Knickerbocker
Also filed as: KNICKERBOCKER JOHN · KNICKERBOCKER JOHN U · KNICKERBOCKER JOHN ULRICH
308 granted patents·56 pending applications·4,661 citations·filing 1986–2024
99Inventor score
Top patents by PatentIndex Score
364 records- 0199US7402442B2Physically highly secure multi-chip assemblyIBM·Filed 2005·Granted Jul 22, 2008·243 cites·7 claims
- 0298US10217637B1Chip handling and electronic component integrationIBM·Filed 2017·Granted Feb 26, 2019·35 cites·13 claims
- 0398US8213184B2Method of testing using a temporary chip attach carrierKNICKERBOCKER JOHN ULRICH·Filed 2008·Granted Jul 3, 2012·107 cites·20 claims
- 0498US7781883B2Electronic package with a thermal interposer and method of manufacturing the sameIBM·Filed 2008·Granted Aug 24, 2010·89 cites·25 claims
- 0598US7768005B2Physically highly secure multi-chip assemblyIBM·Filed 2008·Granted Aug 3, 2010·73 cites·17 claims
- 0698US6528145B1Polymer and ceramic composite electronic substratesIBM·Filed 2000·Granted Mar 4, 2003·208 cites·30 claims
- 0798US6358627B2Rolling ball connectorIBM·Filed 2001·Granted Mar 19, 2002·164 cites·7 claims
- 0897US8110415B2Silicon based microchannel cooling and electrical packageKNICKERBOCKER JOHN ULRICH·Filed 2008·Granted Feb 7, 2012·38 cites·10 claims
- 0997US8048794B23D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transportIBM·Filed 2009·Granted Nov 1, 2011·56 cites·10 claims
- 1096US11307147B2Accurate colorimetric based test strip reader systemIBM·Filed 2020·Granted Apr 19, 2022·6 cites·18 claims
- 1196US10605741B2Accurate colorimetric based test strip reader systemIBM·Filed 2018·Granted Mar 31, 2020·8 cites·21 claims
- 1296US9029238B2Advanced handler wafer bonding and debondingIBM·Filed 2012·Granted May 12, 2015·26 cites·20 claims
- 1396US8344512B2Three-dimensional silicon interposer for low voltage low power systemsIBM·Filed 2009·Granted Jan 1, 2013·45 cites·22 claims
- 1496US8138015B2Interconnection in multi-chip with interposers and bridgesJOSEPH DOUGLAS JAMES·Filed 2011·Granted Mar 20, 2012·50 cites·20 claims
- 1596US8008764B2Bridges for interconnecting interposers in multi-chip integrated circuitsIBM·Filed 2008·Granted Aug 30, 2011·42 cites·18 claims
- 1696US7541203B1Conductive adhesive for thinned silicon wafers with through silicon viasIBM·Filed 2008·Granted Jun 2, 2009·35 cites·1 claims
- 1795US10381255B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2018·Granted Aug 13, 2019·7 cites·11 claims
- 1895US10258142B2Toothbrush with sensorsIBM·Filed 2015·Granted Apr 16, 2019·13 cites·16 claims
- 1995US9773751B1Via and trench filling using injection molded solderingIBM·Filed 2016·Granted Sep 26, 2017·11 cites·17 claims
- 2095US9472789B2Thin, flexible microsystem with integrated energy sourceIBM·Filed 2014·Granted Oct 18, 2016·9 cites·19 claims
- 2195US9269561B2Wafer debonding using long-wavelength infrared radiation ablationGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 23, 2016·16 cites·11 claims
- 2295US7750459B2Integrated module for data processing systemIBM·Filed 2008·Granted Jul 6, 2010·29 cites·17 claims
- 2395US6270363B1Z-axis compressible polymer with fine metal matrix suspensionIBM·Filed 1999·Granted Aug 7, 2001·105 cites·24 claims
- 2494US10224229B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2016·Granted Mar 5, 2019·8 cites·8 claims
- 2594US9761516B1Via and trench filling using injection molded solderingIBM·Filed 2016·Granted Sep 12, 2017·9 cites·14 claims
- 2694US8405226B2Semiconductor device and method of making semiconductor deviceKNICKERBOCKER JOHN U·Filed 2012·Granted Mar 26, 2013·17 cites·11 claims
- 2794US6489686B2Multi-cavity substrate structure for discrete devicesIBM·Filed 2001·Granted Dec 3, 2002·58 cites·11 claims
- 2894US5130067AMethod and means for co-sintering ceramic/metal mlc substratesIBM·Filed 1986·Granted Jul 14, 1992·140 cites·21 claims
- 2993US10297479B2Wafer debonding using mid-wavelength infrared radiation ablationIBM·Filed 2017·Granted May 21, 2019·8 cites·18 claims
- 3093US8117982B2Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant moldGRUBER PETER A·Filed 2009·Granted Feb 21, 2012·25 cites·3 claims
- 3193US7435627B2Techniques for providing decoupling capacitanceIBM·Filed 2005·Granted Oct 14, 2008·18 cites·11 claims
- 3293US7348270B1Techniques for forming interconnectsIBM·Filed 2007·Granted Mar 25, 2008·23 cites·22 claims
- 3393US6177729B1Rolling ball connectorIBM·Filed 1999·Granted Jan 23, 2001·84 cites·23 claims
- 3493US6000033APassword control via the webIBM·Filed 1997·Granted Dec 7, 1999·212 cites·20 claims
- 3592US12014816B2Multi-sensor platform for health monitoringIBM·Filed 2020·Granted Jun 18, 2024·3 cites·20 claims
- 3692US11973058B2Multiple die assemblyIBM·Filed 2021·Granted Apr 30, 2024·2 cites·20 claims
- 3792US9313921B2Chip stack structures that implement two-phase cooling with radial flowIBM·Filed 2013·Granted Apr 12, 2016·12 cites·19 claims
- 3892US9070586B1Method of forming surface protrusions on an article and the article with the protrusions attachedIBM·Filed 2014·Granted Jun 30, 2015·12 cites·16 claims
- 3992US8581392B2Silicon based microchannel cooling and electrical packageIBM·Filed 2012·Granted Nov 12, 2013·8 cites·17 claims
- 4092US7863189B2Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect densityIBM·Filed 2007·Granted Jan 4, 2011·32 cites·10 claims
- 4192US7808798B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2008·Granted Oct 5, 2010·27 cites·14 claims
- 4292US7518229B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2006·Granted Apr 14, 2009·31 cites·3 claims
- 4391US9391040B2Planarity-tolerant reworkable interconnect with integrated testingIBM·Filed 2014·Granted Jul 12, 2016·10 cites·10 claims
- 4491US9324601B1Low temperature adhesive resins for wafer bondingIBM·Filed 2014·Granted Apr 26, 2016·8 cites·12 claims
- 4591US7497366B2Global vacuum injection molded solder system and methodIBM·Filed 2007·Granted Mar 3, 2009·17 cites·1 claims
- 4691US6023407AStructure for a thin film multilayer capacitorIBM·Filed 1998·Granted Feb 8, 2000·80 cites·26 claims
- 4790US9900677B2System for continuous monitoring of body soundsIBM·Filed 2015·Granted Feb 20, 2018·10 cites·20 claims
- 4890US9704822B2Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substratesIBM·Filed 2015·Granted Jul 11, 2017·7 cites·20 claims
- 4990US9159602B2Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriersANDRY PAUL S·Filed 2009·Granted Oct 13, 2015·14 cites·13 claims
- 5090US7518225B2Chip system architecture for performance enhancement, power reduction and cost reductionIBM·Filed 2006·Granted Apr 14, 2009·15 cites·18 claims
Showing the top 50 of 364 patent records by PatentIndex Score.
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