Assignee
FUKUSHIMA DAI
JP·3 granted patents·1 pending application·15 citations·filing 2005–2008
Top patents by PatentIndex Score
4 records- 0186US8152598B2Substrate treating method and substrate treating apparatusFUKUSHIMA DAI·Filed 2008·Granted Apr 10, 2012·13 cites·19 claims
- 0264US8778802B2Polishing method and method for fabricating semiconductor deviceFUKUSHIMA DAI·Filed 2007·Granted Jul 15, 2014·2 cites·17 claims
- 0347US8506362B2Polishing apparatus and polishing methodFUKUSHIMA DAI·Filed 2008·Granted Aug 13, 2013·0 cites·8 claims
- 0439US2005218008A1Method of manufacturing semiconductor deviceFUKUSHIMA DAI·Filed 2005·Application pending·0 cites
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