Assignee
FURUTANI TOSHIKI
JP·9 granted patents·1 pending application·14 citations·filing 2008–2012
Top patents by PatentIndex Score
10 records- 0182US8698303B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceFURUTANI TOSHIKI·Filed 2011·Granted Apr 15, 2014·6 cites·7 claims
- 0272US8975742B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Mar 10, 2015·3 cites·20 claims
- 0370US9059187B2Electronic component having encapsulated wiring board and method for manufacturing the sameFURUTANI TOSHIKI·Filed 2011·Granted Jun 16, 2015·2 cites·20 claims
- 0468US8772648B2Method for manufacturing printed wiring board and printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Jul 8, 2014·2 cites·14 claims
- 0559US8891245B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Nov 18, 2014·1 cites·19 claims
- 0644US8178790B2Interposer and method for manufacturing interposerFURUTANI TOSHIKI·Filed 2008·Granted May 15, 2012·0 cites·15 claims
- 0743US9332657B2Multilayer printed wiring board and method for manufacturing multilayer printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted May 3, 2016·0 cites·4 claims
- 0843US8957320B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Feb 17, 2015·0 cites·19 claims
- 0936US8546922B2Wiring boardFURUTANI TOSHIKI·Filed 2011·Granted Oct 1, 2013·0 cites·20 claims
- 1030US2012018198A1Electronic component and printed wiring boardFURUTANI TOSHIKI·Filed 2011·Application pending·0 cites
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