Electronic component and printed wiring board

Abstract

An electronic component including a substrate having a surface and one or more trench portions opening on the surface, a capacitor portion having a lower electrode formed on the surface of the substrate and on the wall surface of the trench portion, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, a resin filler filling the space inside the trench portion lined by the upper electrode, an insulation layer formed on the surface of the substrate, a conductive portion formed on the insulation layer and positioned to cover the trench portion, and a via conductor connecting the conductive portion and one of the lower electrode and the upper electrode.

1 . An electronic component, comprising:
 a substrate having a surface and at least one trench portion opening on the surface;   a capacitor portion comprising a lower electrode formed on the surface of the substrate and on a wall surface of the trench portion, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer;   a resin filler filling a space inside the trench portion lined by the upper electrode;   an insulation layer formed on the surface of the substrate;   a conductive portion formed on the insulation layer and positioned to cover the trench portion; and   a via conductor connecting the conductive portion and one of the lower electrode and the upper electrode.   
     
     
         2 . The electronic component according to  claim 1 , wherein the conductive portion forms a land portion of the via conductor. 
     
     
         3 . The electronic component according to  claim 1 , wherein the one of the lower electrode and the upper electrode is connected to the via conductor in a region of the substrate where the trench portion is not formed. 
     
     
         4 . The electronic component according to  claim 1 , wherein the resin filler and the insulation layer are made of a same material. 
     
     
         5 . The electronic component according to  claim 1 , wherein the insulation layer comprises a photosensitive resin. 
     
     
         6 . The electronic component according to  claim 1 , wherein the insulation layer is made of a photosensitive resin. 
     
     
         7 . The electronic component according to  claim 1 , wherein the substrate is made of one of silicon, a glass and a ceramic. 
     
     
         8 . The electronic component according to  claim 1 , wherein the lower electrode has a step portion on a periphery portion of an opening of the trench portion. 
     
     
         9 . The electronic component according to  claim 1 , wherein the capacitor portion has a rounded thicker portion on a periphery portion of an opening of the trench portion. 
     
     
         10 . The electronic component according to  claim 1 , wherein the substrate has the at least one trench portion in a plurality. 
     
     
         11 . A method for manufacturing an electronic component, comprising:
 forming at least one trench portion in a substrate such that the trench portion has an opening on a surface of the substrate;   forming on the surface of the substrate and a wall portion of the trench portion a capacitor portion comprising a lower electrode, a dielectric layer and an upper electrode;   filling a resin filler in a space inside the trench portion lined by the upper electrode;   forming an insulation layer on the surface of the substrate;   forming a conductive portion on the insulation layer such that the conductive portion covers the trench portion; and   forming a via conductor in the insulation layer such that the conductive portion is connected to one of the lower electrode and the upper electrode.   
     
     
         12 . The method for manufacturing an electronic component according to  claim 11 , wherein the forming of the capacitor portion comprises forming the lower electrode on the surface of the substrate and on the wall surface of the trench portion, forming the dielectric layer on the lower electrode, and forming the upper electrode on the dielectric layer. 
     
     
         13 . The method for manufacturing an electronic component according to  claim 11 , wherein the resin filler and the insulation layer comprises a same material. 
     
     
         14 . The method for manufacturing an electronic component according to  claim 11 , wherein the resin filler and the insulation layer are made of a same material. 
     
     
         15 . The method for manufacturing an electronic component according to  claim 11 , wherein the insulation layer comprises a photosensitive resin. 
     
     
         16 . The method for manufacturing an electronic component according to  claim 11 , wherein the insulation layer made of a photosensitive resin. 
     
     
         17 . The method for manufacturing an electronic component according to  claim 11 , wherein the forming of the capacitor portion comprises forming a step portion in the lower electrode on a periphery portion of the opening of the trench portion. 
     
     
         18 . The method according to  claim 11 , wherein the forming of the capacitor portion comprises forming a rounded thicker portion in the capacitor on a periphery portion of the opening of the trench portion. 
     
     
         19 . The method for manufacturing an electronic component according to  claim 11 , further comprising removing a portion of the dielectric layer by using the insulation layer as a mask. 
     
     
         20 . The method for manufacturing an electronic component according to  claim 11 , wherein the forming of the at least one trench comprises forming the trench in a plurality.