Inventor · disambiguated record
Daiki Komatsu
Also filed as: KOMATSU DAIKI
46 granted patents·34 pending applications·73 citations·filing 2008–2025
96Inventor score
Files withTEXAS INSTRUMENTS INC29FUJIFILM CORP22IBIDEN CO LTD10FURUTANI TOSHIKI4VEHICLE ENERGY JAPAN INC4
Top patents by PatentIndex Score
80 records- 0185US10807494B2Battery management system, battery system and hybrid vehicle control systemVEHICLE ENERGY JAPAN INC·Filed 2017·Granted Oct 20, 2020·2 cites·7 claims
- 0284US12230539B2Wafer chip scale packaging with ball attach before repassivationTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 18, 2025·4 cites·4 claims
- 0384US11288780B2Imaging apparatusFUJIFILM CORP·Filed 2020·Granted Mar 29, 2022·2 cites·19 claims
- 0484US11062980B2Integrated circuit packages with wettable flanks and methods of manufacturing the sameTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 13, 2021·4 cites·13 claims
- 0584US10541220B1Printed repassivation for wafer chip scale packagingTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 21, 2020·4 cites·26 claims
- 0682US8698303B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceFURUTANI TOSHIKI·Filed 2011·Granted Apr 15, 2014·6 cites·7 claims
- 0781US8373069B2Electronic component mounting substrate and method for manufacturing electronic component mounting substrateIBIDEN CO LTD·Filed 2009·Granted Feb 12, 2013·10 cites·7 claims
- 0880US8829355B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2009·Granted Sep 9, 2014·8 cites·18 claims
- 0980US2025224463A1Hall Sensor Using Face Down Structure with Through Substrate ViasTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1079US9066435B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Jun 23, 2015·4 cites·20 claims
- 1178US9279966B2Zoom lens and imaging apparatusFUJIFILM CORP·Filed 2014·Granted Mar 8, 2016·4 cites·17 claims
- 1277US12259445B2Hall sensor using face down structure with through substrate viasTEXAS INSTRUMENTS INC·Filed 2022·Granted Mar 25, 2025·0 cites·19 claims
- 1377US9536801B2Electronic component having encapsulated wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jan 3, 2017·2 cites·20 claims
- 1476US2024337699A1Battery control deviceVEHICLE ENERGY JAPAN INC·Filed 2024·Application pending·0 cites
- 1575US8362367B2Multilayer printed wiring board and method for manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 2009·Granted Jan 29, 2013·6 cites·13 claims
- 1673US2024379597A1Wafer chip scale packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1770US9059187B2Electronic component having encapsulated wiring board and method for manufacturing the sameFURUTANI TOSHIKI·Filed 2011·Granted Jun 16, 2015·2 cites·20 claims
- 1869US8188378B2Interposer and method for manufacturing interposerSAKAMOTO HAJIME·Filed 2008·Granted May 29, 2012·4 cites·17 claims
- 1968US11855564B2Control device and electric vehicleHITACHI LTD·Filed 2020·Granted Dec 26, 2023·0 cites·7 claims
- 2068US8922906B2Zoom lens and imaging apparatusFUJIFILM CORP·Filed 2014·Granted Dec 30, 2014·2 cites·8 claims
- 2167US11374425B2Battery energy storage system, battery management system, and control method for controlling battery temperatureHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2018·Granted Jun 28, 2022·1 cites·1 claims
- 2265US11217513B2Integrated circuit package with pre-wetted contact sidewall surfacesTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 4, 2022·0 cites·17 claims
- 2365US9715093B2Zoom lens and imaging apparatusFUJIFILM CORP·Filed 2015·Granted Jul 25, 2017·1 cites·20 claims
- 2465US2025362482A1Imaging lens and imaging apparatusFUJIFILM CORP·Filed 2025·Application pending·0 cites
- 2564US9606336B2Zoom lens and imaging apparatusFUJIFILM CORP·Filed 2014·Granted Mar 28, 2017·1 cites·19 claims
- 2664US8964305B2Zoom lens and imaging apparatusFUJIFILM CORP·Filed 2013·Granted Feb 24, 2015·1 cites·16 claims
- 2764US8395054B2Substrate for mounting semiconductor element and method for manufacturing substrate for mounting semiconductor elementKARIYA TAKASHI·Filed 2009·Granted Mar 12, 2013·2 cites·9 claims
- 2863US12057417B2Wafer chip scale packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 6, 2024·0 cites·30 claims
- 2961US2025035898A1Zoom lens and imaging apparatusFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 3061US2025110320A1Zoom lens and imaging apparatusFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 3160US9565756B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Feb 7, 2017·1 cites·20 claims
- 3260US8441133B2Semiconductor deviceKOMATSU DAIKI·Filed 2010·Granted May 14, 2013·2 cites·20 claims
- 3358US2025218975A1Wafer-level chip scale package semiconductor devices with light blocking material and methodsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3458US2025140624A1Packages with isolated diesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3558US2015026975A1Multilayer printed wiring boardIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 3658US2025140626A1Sensor electronic deviceTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3758US2022003822A1Battery control deviceVEHICLE ENERGY JAPAN INC·Filed 2019·Application pending·0 cites
- 3858US2025112182A1Semiconductor package with an insulation layerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3957US2025038009A1Stress relief sawn quad flat no-lead semiconductor packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4057US2025006575A1Semiconductor package with covered magnetic mold compoundTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4156US2024363465A1Die isolation with conformal coatingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4256US2024395731A1Electronic device with a reinforcing layerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4355US12292554B2Zoom lens and imaging apparatusFUJIFILM CORP·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 4455US9338886B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceIBIDEN CO LTD·Filed 2014·Granted May 10, 2016·0 cites·20 claims
- 4555US2024290676A1Shielded lead package for high voltage devicesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4654US11061200B2Imaging apparatus, image processing apparatus, image processing method, and image processing programFUJIFILM CORP·Filed 2019·Granted Jul 13, 2021·0 cites·14 claims
- 4754US10636729B2Integrated circuit package with pre-wetted contact sidewall surfacesTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 28, 2020·0 cites·29 claims
- 4854US8785255B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceIBIDEN CO LTD·Filed 2014·Granted Jul 22, 2014·0 cites·7 claims
- 4954US2024145454A1Optical sensor with tsv structureTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 5054US2024178104A1Leadframe based power moduleTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →