Inventor · disambiguated record
Toshiki Furutani
Also filed as: FURUTANI TOSHIKI
78 granted patents·27 pending applications·350 citations·filing 2004–2025
99Inventor score
Top patents by PatentIndex Score
105 records- 0198US8971053B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Mar 3, 2015·62 cites·20 claims
- 0297US7462784B2Heat resistant substrate incorporated circuit wiring boardIBIDEN CO LTD·Filed 2006·Granted Dec 9, 2008·50 cites·10 claims
- 0390US9807885B2Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Oct 31, 2017·8 cites·20 claims
- 0489US8008583B2Heat resistant substrate incorporated circuit wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 30, 2011·12 cites·8 claims
- 0588US7994432B2Heat resistant substrate incorporated circuit wiring boardIBIDEN CO LTD·Filed 2009·Granted Aug 9, 2011·11 cites·10 claims
- 0687US7497694B2Printed board with a pin for mounting a componentIBIDEN CO LTD·Filed 2006·Granted Mar 3, 2009·14 cites·20 claims
- 0786US12258011B2Vehicle controller and method for controlling vehicleTOYOTA MOTOR CO LTD·Filed 2022·Granted Mar 25, 2025·1 cites·3 claims
- 0886US8923008B2Circuit board and method for manufacturing circuit boardYOSHIKAWA KAZUHIRO·Filed 2012·Granted Dec 30, 2014·7 cites·20 claims
- 0985US9215805B2Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Dec 15, 2015·8 cites·17 claims
- 1085US7495332B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Feb 24, 2009·12 cites·9 claims
- 1184US9357660B2Printed circuit board, and method for manufacturing printed circuit boardIBIDEN CO LTD·Filed 2013·Granted May 31, 2016·7 cites·18 claims
- 1284US8541691B2Heat resistant substrate incorporated circuit wiring boardKARIYA TAKASHI·Filed 2010·Granted Sep 24, 2013·4 cites·30 claims
- 1383US9951434B2Printed wiring board, semiconductor package and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2015·Granted Apr 24, 2018·4 cites·20 claims
- 1483US9601422B2Printed wiring board, semiconductor package, and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2015·Granted Mar 21, 2017·5 cites·20 claims
- 1582US8952507B2Wiring board and method for manufacturing wiring boardIBIDEN CO LTD·Filed 2013·Granted Feb 10, 2015·6 cites·16 claims
- 1682US8698303B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceFURUTANI TOSHIKI·Filed 2011·Granted Apr 15, 2014·6 cites·7 claims
- 1782US8507806B2Heat resistant substrate incorporated circuit wiring boardKARIYA TAKASHI·Filed 2009·Granted Aug 13, 2013·6 cites·20 claims
- 1882US7489521B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2007·Granted Feb 10, 2009·8 cites·11 claims
- 1982US7262975B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Aug 28, 2007·8 cites·16 claims
- 2081US8654538B2Wiring board and method for manufacturing the sameKARIYA TAKASHI·Filed 2011·Granted Feb 18, 2014·5 cites·20 claims
- 2181US7773388B2Printed wiring board with component mounting pin and electronic device using the sameIBIDEN CO LTD·Filed 2006·Granted Aug 10, 2010·9 cites·20 claims
- 2280US9232656B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Jan 5, 2016·4 cites·21 claims
- 2378US9439289B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2012·Granted Sep 6, 2016·4 cites·20 claims
- 2478US8466372B2Wiring board with built-in electronic component and method for manufacturing the sameSAKAI SHUNSUKE·Filed 2009·Granted Jun 18, 2013·7 cites·16 claims
- 2577US9536801B2Electronic component having encapsulated wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jan 3, 2017·2 cites·20 claims
- 2677US8908387B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2012·Granted Dec 9, 2014·3 cites·19 claims
- 2777US8347493B2Wiring board with built-in electronic component and method of manufacturing sameIBIDEN CO LTD·Filed 2009·Granted Jan 8, 2013·8 cites·14 claims
- 2876US10098243B2Printed wiring board and semiconductor packageIBIDEN CO LTD·Filed 2015·Granted Oct 9, 2018·3 cites·20 claims
- 2976US9497849B2Printed wiring boardIBIDEN CO LTD·Filed 2013·Granted Nov 15, 2016·4 cites·20 claims
- 3076US8415781B2Electronic component and method for manufacturing the sameKARIYA TAKASHI·Filed 2011·Granted Apr 9, 2013·4 cites·17 claims
- 3176US8169792B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2011·Granted May 1, 2012·3 cites·10 claims
- 3275US10182518B2Shield cap and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Jan 15, 2019·2 cites·20 claims
- 3375US8693209B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2012·Granted Apr 8, 2014·3 cites·21 claims
- 3474US9307643B2Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic componentIBIDEN CO LTD·Filed 2014·Granted Apr 5, 2016·4 cites·20 claims
- 3572US8975742B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Mar 10, 2015·3 cites·20 claims
- 3672US8225503B2Method for manufacturing board with built-in electronic elementsKARIYA TAKASHI·Filed 2008·Granted Jul 24, 2012·5 cites·10 claims
- 3772US7754978B2Multilayer printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2006·Granted Jul 13, 2010·4 cites·14 claims
- 3871US9204552B2Printed wiring boardIBIDEN CO LTD·Filed 2012·Granted Dec 1, 2015·3 cites·20 claims
- 3971US7731504B2Printed board with component mounting pinIBIDEN CO LTD·Filed 2008·Granted Jun 8, 2010·3 cites·20 claims
- 4070US9059187B2Electronic component having encapsulated wiring board and method for manufacturing the sameFURUTANI TOSHIKI·Filed 2011·Granted Jun 16, 2015·2 cites·20 claims
- 4170US8058563B2Interposer and method for manufacturing interposerSAKAMOTO HAJIME·Filed 2008·Granted Nov 15, 2011·4 cites·20 claims
- 4269US9119322B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 25, 2015·1 cites·20 claims
- 4369US8188378B2Interposer and method for manufacturing interposerSAKAMOTO HAJIME·Filed 2008·Granted May 29, 2012·4 cites·17 claims
- 4469US7881071B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Feb 1, 2011·2 cites·12 claims
- 4568US10231336B2Printed wiring board for mounting electronic componentIBIDEN CO LTD·Filed 2018·Granted Mar 12, 2019·1 cites·20 claims
- 4668US9474158B2Printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Oct 18, 2016·2 cites·20 claims
- 4768US9220168B2Wiring board with built-in electronic componentIBIDEN CO LTD·Filed 2014·Granted Dec 22, 2015·3 cites·20 claims
- 4868US8772648B2Method for manufacturing printed wiring board and printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Jul 8, 2014·2 cites·14 claims
- 4968US7971354B2Method of manufacturing a multilayer printed wiring boardIBIDEN CO LTD·Filed 2010·Granted Jul 5, 2011·2 cites·8 claims
- 5063US9564392B2Printed wiring board and semiconductor packageIBIDEN CO LTD·Filed 2016·Granted Feb 7, 2017·1 cites·20 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →