Assignee
GLOBALWAFERS JAPAN CO LTD
JP·17 granted patents·14 pending applications·14 citations·filing 2013–2025
Top patents by PatentIndex Score
31 records- 0186US12046469B2Manufacturing method for semiconductor silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2021·Granted Jul 23, 2024·2 cites·7 claims
- 0284US9541452B2Calibration curve formation method, impurity concentration measurement method, and semiconductor wafer manufacturing methodGLOBALWAFERS JAPAN CO LTD·Filed 2015·Granted Jan 10, 2017·7 cites·13 claims
- 0378US12084785B2Method and apparatus for pulling single crystalGLOBALWAFERS JAPAN CO LTD·Filed 2020·Granted Sep 10, 2024·1 cites·3 claims
- 0469US2026014594A1Cleaning method of susceptorGLOBALWAFERS JAPAN CO LTD·Filed 2025·Application pending·0 cites
- 0567US11887845B2Method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrateGLOBALWAFERS JAPAN CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·5 claims
- 0667US2024393052A1Heat treatment apparatus, method of maintaining heat treatment apparatus, and method of regenerating lamp sleeveGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 0765US11162191B2Thermal processing method for silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted Nov 2, 2021·1 cites·4 claims
- 0862US10330599B2Calibration curve determination method, carbon concentration measurement method, and silicon wafer-manufacturing methodGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted Jun 25, 2019·2 cites·10 claims
- 0962US10141180B2Silicon wafer and method for manufacturing the sameGLOBALWAFERS JAPAN CO LTD·Filed 2014·Granted Nov 27, 2018·1 cites·3 claims
- 1060US2024395584A1Heat treatment apparatus and semiconductor substrate manufacturing methodGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025138080A1Evaluation method of metal contaminationGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 1259US2024339315A1Method of manufacturing silicon wafersGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 1358US2024379341A1Method of manufacturing semiconductor wafers and method of manufacturing semiconductor devicesGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 1458US2024363363A1Method of manufacturing semiconductor wafer and semiconductor deviceGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 1557US12371813B2Silicon wafer and method for producing silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·4 claims
- 1652US10916421B2Method of manufacturing epitaxial silicon wafersGLOBALWAFERS JAPAN CO LTD·Filed 2019·Granted Feb 9, 2021·0 cites·4 claims
- 1751US2025051961A1Method of manufacturing silicon epitaxial substrate and silicon epitaxial substrateGLOBALWAFERS JAPAN CO LTD·Filed 2022·Application pending·0 cites
- 1850US2013251950A1Silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2013·Application pending·0 cites
- 1950US2020211840A1Method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrateGLOBALWAFERS JAPAN CO LTD·Filed 2018·Application pending·0 cites
- 2049US11754497B2Method for measuring extremely low oxygen concentration in silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2019·Granted Sep 12, 2023·0 cites·5 claims
- 2146US2023073641A1Manufacturing method for semiconductor silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2021·Application pending·0 cites
- 2245US12308228B2Manufacturing method for semiconductor silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2021·Granted May 20, 2025·0 cites·7 claims
- 2345US11060983B2Evaluation method of silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2018·Granted Jul 13, 2021·0 cites·6 claims
- 2442US12488979B2Lamination wafers and method of producing bonded wafers using the sameGLOBALWAFERS JAPAN CO LTD·Filed 2020·Granted Dec 2, 2025·0 cites·3 claims
- 2540US10648101B2Silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted May 12, 2020·0 cites·12 claims
- 2639US2013175726A1Method for manufacturing silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2013·Application pending·0 cites
- 2734US11538721B2Evaluation method of metal contaminationGLOBALWAFERS JAPAN CO LTD·Filed 2018·Granted Dec 27, 2022·0 cites·5 claims
- 2834US2015017086A1Silicon single crystal and method for manufacture thereofGLOBALWAFERS JAPAN CO LTD·Filed 2014·Application pending·0 cites
- 2934US2016293446A1Method for manufacturing a silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2016·Application pending·0 cites
- 3033US12378695B2Method for heat-treating silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2019·Granted Aug 5, 2025·0 cites·4 claims
- 3133US10840089B2Protective-film forming method for semiconductor substrateGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted Nov 17, 2020·0 cites·7 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →