Assignee
GOMEZ JOCEL P
PH·1 granted patent·5 pending applications·7 citations·filing 2007–2010
Top patents by PatentIndex Score
6 records- 0177US8067273B2Self locking and aligning clip structure for semiconductor die packageGOMEZ JOCEL P·Filed 2010·Granted Nov 29, 2011·7 cites·9 claims
- 0237US2009294985A1Thin chip scale semiconductor packageGOMEZ JOCEL P·Filed 2008·Application pending·0 cites
- 0337US2009194856A1Molded package assemblyGOMEZ JOCEL P·Filed 2008·Application pending·0 cites
- 0437US2009127677A1Multi-Terminal Package Assembly For Semiconductor DevicesGOMEZ JOCEL P·Filed 2007·Application pending·0 cites
- 0537US2009127676A1Back to Back Die Assembly For Semiconductor DevicesGOMEZ JOCEL P·Filed 2007·Application pending·0 cites
- 0637US2010267206A1Semiconductor die package including heat sinksGOMEZ JOCEL P·Filed 2010·Application pending·0 cites
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