Assignee
HALL FRANK L
US·1 granted patent·8 pending applications·1 citations·filing 2005–2006
Top patents by PatentIndex Score
9 records- 0154US8093730B2Underfilled semiconductor die assemblies and methods of forming the sameHALL FRANK L·Filed 2006·Granted Jan 10, 2012·1 cites·26 claims
- 0246US2006249493A1Methods for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 0346US2006249492A1Methods for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 0446US2006249494A1Methods for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 0546US2006249495A1Methods for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 0645US2006113291A1Method for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 0745US2006163573A1Method for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 0841US2005253241A1Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assemblyHALL FRANK L·Filed 2005·Application pending·0 cites
- 0941US2005263906A1Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrierHALL FRANK L·Filed 2005·Application pending·0 cites
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