Assignee
HAMADA MITSUYOSHI
JP·1 granted patent·3 pending applications·2 citations·filing 2006–2012
Top patents by PatentIndex Score
4 records- 0148US8084130B2Epoxy resin molding material for sealing and electronic component deviceHAMADA MITSUYOSHI·Filed 2007·Granted Dec 27, 2011·2 cites·14 claims
- 0239US2014128505A1Epoxy resin molding material for sealing and electronic component deviceHAMADA MITSUYOSHI·Filed 2012·Application pending·0 cites
- 0335US2009012233A1Epoxy Resin Molding Material for Sealing and Electronic Component DeviceHAMADA MITSUYOSHI·Filed 2007·Application pending·0 cites
- 0434US2009247670A1Epoxy Resin Molding Material for Sealing, and Electronic Component DeviceHAMADA MITSUYOSHI·Filed 2006·Application pending·0 cites
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