Epoxy resin molding material for sealing and electronic component device

Abstract

An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

1 . An epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxysilane compound. 
     
     
         2 . The epoxy resin molding material for sealing according to  claim 1 , wherein (E1) the arylamino group-containing alkoxysilane compound is a compound represented by the following general formula (I): 
       
         
           
           
               
               
           
         
         wherein in the general formula (I), R 1  and R 2  each independently represent a hydrocarbon group having 1 to 6 carbon atoms, which may have a substituent; p represents an integer from 1 to 3; and q represents 2 or 3. 
       
     
     
         3 . The epoxy resin molding material for sealing according to  claim 1 , wherein (E2) the epoxy group-containing alkoxysilane compound is at least one compounds represented by the following general formulas (II) or (III): 
       
         
           
           
               
               
           
         
         wherein the general formula (II), R 1  and R 2  each independently represent a hydrocarbon group having 1 to 6 carbon atoms, which may have a substituent; p represents an integer from 1 to 3; and q represents 2 or 3; and 
       
       
         
           
           
               
               
           
         
         wherein in the general formula (III), R 1  and R 2  each independently represent a hydrocarbon group having 1 to 6 carbon atoms, which may have a substituent; p represents an integer from 1 to 3; and q represents 2 or 3. 
       
     
     
         4 . The epoxy resin molding material for sealing according to  claim 1 , wherein a total amount of (E1) the arylamino group-containing alkoxysilane compound in the epoxy resin molding material for sealing is from 10% by mass to 80% by mass with respect to a total amount of (E1) the arylamino group-containing alkoxysilane compound and (E2) the epoxy group-containing alkoxy silane compound in the epoxy resin molding material for sealing. 
     
     
         5 . The epoxy resin molding material for sealing according to  claim 1 , wherein the total amount of (E1) the arylamino group-containing alkoxysilane compound and (E2) the epoxy group-containing alkoxy silane compound in the epoxy resin molding material for sealing is from 2% by mass to 15% by mass with respect to a total amount of the epoxy resin (A) in the epoxy resin molding material for sealing. 
     
     
         6 . An electronic component device comprising an element sealed with the epoxy resin molding material for sealing according to  claim 1 .