Inventor · disambiguated record
Keizo Takemiya
Also filed as: TAKEMIYA KEIZO
2 granted patents·1 pending application·46 citations·filing 2000–2017
57Inventor score
Top patents by PatentIndex Score
3 records- 0180US6372351B1Encapsulant epoxy resin composition and electronic deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Apr 16, 2002·46 cites·14 claims
- 0262US10662315B2Epoxy resin molding material for sealing and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted May 26, 2020·0 cites·4 claims
- 0339US2014128505A1Epoxy resin molding material for sealing and electronic component deviceHAMADA MITSUYOSHI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →