Assignee
HATAKEYAMA KEIICHI
JP·2 granted patents·2 pending applications·31 citations·filing 2008–2012
Top patents by PatentIndex Score
4 records- 0190US8198176B2Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor deviceHATAKEYAMA KEIICHI·Filed 2008·Granted Jun 12, 2012·27 cites·8 claims
- 0268US8071465B2Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor deviceHATAKEYAMA KEIICHI·Filed 2008·Granted Dec 6, 2011·4 cites·2 claims
- 0345US2012295400A1Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor deviceHATAKEYAMA KEIICHI·Filed 2012·Application pending·0 cites
- 0443US2011318879A1Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor deviceHATAKEYAMA KEIICHI·Filed 2011·Application pending·0 cites
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