Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Abstract

The method for producing a semiconductor chip with an adhesive film includes preparing a laminate of a divided semiconductor wafer, an adhesive film and a dicing tape, the adhesive film having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate. The divided semiconductor wafer has been obtained by cutting the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut.

1 . A method for producing a semiconductor device, comprising a step of bonding a semiconductor chip with an adhesive film to another semiconductor chip or to a semiconductor chip mounting support member,
 wherein said semiconductor chip with an adhesive film has been obtained by a method comprising:   preparing a laminate in which at least a divided semiconductor wafer comprising a plurality of semiconductor chips, obtained by forming a cut which separates the semiconductor wafer into a plurality of semiconductor chips on one side of the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut, an adhesive film for a semiconductor and a dicing tape are laminated, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and   dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing the semiconductor chip with the adhesive film.   
     
     
         2 . An adhesive film for a semiconductor used in the method according to  claim 1 , the adhesive film for a semiconductor having the thickness in the range of 1 to 15 μm and the tensile elongation at break of less than 5%, the tensile elongation at break being less than 110% of the elongation at a maximum load.