Inventor · disambiguated record
Keiichi Hatakeyama
Also filed as: HATAKEYAMA KEIICHI
12 granted patents·21 pending applications·124 citations·filing 2001–2025
90Inventor score
Top patents by PatentIndex Score
33 records- 0190US8198176B2Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor deviceHATAKEYAMA KEIICHI·Filed 2008·Granted Jun 12, 2012·27 cites·8 claims
- 0288US7517724B2Dicing/die bonding sheetHITACHI CHEMICAL CO LTD·Filed 2005·Granted Apr 14, 2009·22 cites·15 claims
- 0385US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0484US8034659B2Production method of semiconductor device and bonding filmHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 11, 2011·12 cites·13 claims
- 0584US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0679US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 0773US12482670B2Method for manufacturing semiconductor device and semiconductor deviceRESONAC CORP·Filed 2024·Granted Nov 25, 2025·0 cites·19 claims
- 0871US12362248B2Method for manufacturing semiconductor device, semiconductor device, and semiconductor memberRESONAC CORP·Filed 2024·Granted Jul 15, 2025·0 cites·26 claims
- 0968US8071465B2Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor deviceHATAKEYAMA KEIICHI·Filed 2008·Granted Dec 6, 2011·4 cites·2 claims
- 1068US2025309014A1Semiconductor device, and semiconductor memberRESONAC CORP·Filed 2025·Application pending·0 cites
- 1165US2025293105A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 1265US2025259859A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 1361US2025287514A1Method for manufacturing electronic component deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 1457US6602132B2Game system and computer-readable storage medium carrying program thereforKONAMI CORP·Filed 2001·Granted Aug 5, 2003·8 cites·7 claims
- 1557US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1653US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 1751US2025279393A1Semiconductor device production method and structureRESONAC CORP·Filed 2023·Application pending·0 cites
- 1850US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 1948US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 2047US8232185B2Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the filmNAKAMURA YUUKI·Filed 2008·Granted Jul 31, 2012·0 cites·7 claims
- 2147US2025266342A1Manufacturing method for thin wiring member, thin wiring member, and manufacturing method for wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 2247US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 2347US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 2445US2012295400A1Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor deviceHATAKEYAMA KEIICHI·Filed 2012·Application pending·0 cites
- 2543US2011318879A1Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor deviceHATAKEYAMA KEIICHI·Filed 2011·Application pending·0 cites
- 2642US2012244347A1Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the filmNAKAMURA YUUKI·Filed 2012·Application pending·0 cites
- 2742US2011193244A1Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor deviceMASUKO TAKASHI·Filed 2011·Application pending·0 cites
- 2840US8404564B2Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using themNAKAMURA YUUKI·Filed 2008·Granted Mar 26, 2013·0 cites·7 claims
- 2940US2011060136A1Dendrimer-coated magnetic fine particles, and method for preparing same and utility thereofUNIV TOKYO AGRICULTURE·Filed 2010·Application pending·0 cites
- 3040US2011057145A1Method for preparing dendrimer-modified, magnetic fine particlesUNIV TOKYO AGRICULTURE·Filed 2010·Application pending·0 cites
- 3140US2015179494A1Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 3239US2007098995A1Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
- 3337US2003069331A1Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →