Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film

Abstract

There is an adhesive film for a semiconductor for use in a method for manufacturing a semiconductor chip. The method includes preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5%, and the tensile breaking elongation is less than 110% of the elongation at maximum load. The semiconductor wafer is partitioned into multiple semiconductor chips and notches are formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction. The method also includes stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches.

1 . An adhesive film for a semiconductor for use in a method for manufacturing a semiconductor chip comprising the steps of:
 preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the adhesive film for a semiconductor having a tensile breaking elongation of less than 5%, the tensile breaking elongation being less than 110% of the elongation at maximum load, the semiconductor wafer being partitioned into multiple semiconductor chips and notches being formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction, and   stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches,   wherein the adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load.   
     
     
         2 . The adhesive film for a semiconductor according to  claim 1 , which can be attached to a semiconductor wafer at 100° C. or below. 
     
     
         3 . The adhesive film for a semiconductor according to  claim 1 , which comprises a thermoplastic resin, a thermosetting component and a filler, a filler content being less than 30% by mass with respect to the mass of the adhesive film for a semiconductor. 
     
     
         4 . A composite sheet comprising
 the adhesive film for a semiconductor according to  claim 1 , and   dicing tape laminated on one side of the adhesive film for a semiconductor.   
     
     
         5 . An adhesive film for a semiconductor for use in a method for manufacturing a semiconductor chip comprising the steps of:
 preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the adhesive film for a semiconductor having a tensile breaking elongation of less than 5% and the tensile breaking elongation being less than 110% of the elongation at maximum load, with reformed sections formed in the semiconductor wafer by laser working along lines for division of the semiconductor wafer into multiple semiconductor chips, and   stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to partition the semiconductor wafer into multiple semiconductor chips while partitioning the adhesive film for a semiconductor along the reformed sections,   wherein the adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load.   
     
     
         6 . The adhesive film for a semiconductor according to  claim 5 , which can be attached to a semiconductor wafer at 100° C. or below. 
     
     
         7 . The adhesive film for a semiconductor according to  claim 5 , which comprises a thermoplastic resin, a thermosetting component and a filler, a filler content being less than 30% by mass with respect to the mass of the adhesive film for a semiconductor. 
     
     
         8 . A composite sheet comprising
 the adhesive film for a semiconductor according to  claim 5  and   dicing tape laminated on one side of the adhesive film for a semiconductor.