Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Abstract

Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

1 . A semiconductor device, comprising:
 a semiconductor chip;   a substrate having a circuit, or a film having a circuit; and   an adhesive film, the semiconductor chip and the substrate or film being adhered to each other through the adhesive film,   wherein the adhesive film comprises a cured product of an adhesive composition comprising:
 (a) at least one epoxy resin; 
 (b) a curing agent; and 
 (c) a polymer compound incompatible with at least one of the epoxy resins; and 
   wherein the curing agent is a phenolic resin having a hydroxyl equivalent of 150 g/eq or more.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein said polymer compound incompatible with said at least one of the epoxy resins is an epoxy group-containing acrylic copolymer incompatible with said at least one of the epoxy resins. 
     
     
         3 . The semiconductor device according to  claim 1 , wherein (b) the curing agent is a phenolic resin represented by the following general formula (I): 
       
         
           
           
               
               
           
         
       
       wherein R 1  each may be the same or different from each other and represents a hydrogen atom, a straight or branched alkyl group having 1 to 10 carbon atoms, a cyclic alkyl group, an aralkyl group, an alkenyl group, a hydroxyl group, an aryl group, or a halogen atom; n represents an integer of 1 to 3; and m represents an integer of 0 to 50. 
     
     
         4 . The semiconductor device according to  claim 1 , wherein a ratio of A/B is 0.24 to 1.0, where A represents a total weight of (a) the at least one epoxy resin and (b) the curing agent, and B represents a weight of (c) the polymer compound incompatible with at least one of the epoxy resins. 
     
     
         5 . The semiconductor device according to  claim 1 , wherein the adhesive film further comprises (d) a filler. 
     
     
         6 . The semiconductor device according to  claim 5 , wherein (d) the filler is silica. 
     
     
         7 . The semiconductor device according to  claim 1 , wherein the adhesive film satisfies at least one of the following requirements (i) to (iii):
 (i) components of the adhesive film are separated into two phases as viewed in the cross-section thereof;   (ii) the adhesive film has a storage elastic modulus at 240° C. of 1 to 20 MPa; and   (iii) the adhesive film has pores having an average diameter of 0.01 μm to 2 μm and a volume percentage of the pores is 0.1 to 20% by volume.   
     
     
         8 . The semiconductor device according to  claim 1 , wherein said substrate having a circuit, or said film having a circuit, is a wiring board of an organic material and having a circuit thereon. 
     
     
         9 . The semiconductor device according to  claim 1 , wherein the at least one epoxy resin includes at least one selected from the group consisting of phenol novolak epoxy resin and cresol novolak epoxy resin. 
     
     
         10 . The semiconductor device according to  claim 9 , wherein the polymer compound incompatible with at least one of the at least one epoxy resin is an epoxy group-containing acrylic copolymer. 
     
     
         11 . The semiconductor device according to  claim 10 , wherein (b) the curing agent is a phenolic resin represented by the following general formula (I): 
       
         
           
           
               
               
           
         
       
       wherein R 1  each may be the same or different from each other and represents a hydrogen atom, a straight or branched alkyl group having 1 to 10 carbon atoms, a cyclic alkyl group, an aralkyl group, an alkenyl group, a hydroxyl group, an aryl group, or a halogen atom; n represents an integer of 1 to 3; and m represents an integer of 0 to 50. 
     
     
         12 . The semiconductor device according to  claim 9 , wherein (b) the curing agent is a phenolic resin represented by the following general formula (I): 
       
         
           
           
               
               
           
         
       
       wherein R 1  each may be the same or different from each other and represents a hydrogen atom, a straight or branched alkyl group having 1 to 10 carbon atoms, a cyclic alkyl group, an aralkyl group, an alkenyl group, a hydroxyl group, an aryl group, or a halogen atom; n represents an integer of 1 to 3; and m represents an integer of 0 to 50.