Inventor · disambiguated record
Takeo Tomiyama
Also filed as: TOMIYAMA TAKEO
7 granted patents·15 pending applications·181 citations·filing 1997–2016
86Inventor score
Top patents by PatentIndex Score
22 records- 0189US6265782B1Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated filmHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 24, 2001·99 cites·37 claims
- 0285US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0384US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0482US6621170B2Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Sep 16, 2003·29 cites·29 claims
- 0579US9150706B2Photo curable resin composition, imaging display device and production method thereofHITACHI CHEMICAL CO LTD·Filed 2013·Granted Oct 6, 2015·2 cites·14 claims
- 0679US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 0765US9394457B2Photo curable resin composition, imaging display device and production method thereofHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jul 19, 2016·0 cites·7 claims
- 0864US2016312085A1Photo curable resin composition, imaging display device and production method thereofHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 0957US2017037219A1Photocurable resin composition, image display device, and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 1057US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1154US2015050509A1Photocurable resin composition, image display device, and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1253US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 1352US2010160587A1Thermosetting resin composition and optical member using cured product of the thermosetting resin compositionYOSHIDA AKIHIRO·Filed 2008·Application pending·0 cites
- 1450US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 1548US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 1647US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 1747US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 1844US2010227993A1Resin Composition and Optical Material Using the SameKOBAYASHI SHINGO·Filed 2007·Application pending·0 cites
- 1944US2010200890A1Curable resin composition, led package, and method for production of the led package, and optical semiconductorTOMIYAMA TAKEO·Filed 2008·Application pending·0 cites
- 2042US2009292049A1Resin composition and optical member formed from the sameTOMIYAMA TAKEO·Filed 2006·Application pending·0 cites
- 2137US2003069331A1Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor deviceFiled 2001·Application pending·0 cites
- 2236US2012196977A1Urethane resin composition, cured object, and photosemiconductor device using cured objectTOMIYAMA TAKEO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →