Inventor · disambiguated record
Tetsurou Iwakura
Also filed as: IWAKURA TETSUROU
7 granted patents·8 pending applications·53 citations·filing 2001–2017
80Inventor score
Top patents by PatentIndex Score
15 records- 0185US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0284US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0379US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 0475US8200059B2Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of themSHIBATA TOMOAKI·Filed 2008·Granted Jun 12, 2012·2 cites·29 claims
- 0558US11331888B2Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method thereforHITACHI CHEMICAL CO LTD·Filed 2017·Granted May 17, 2022·0 cites·12 claims
- 0657US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0755US11827789B2Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2017·Granted Nov 28, 2023·0 cites·8 claims
- 0853US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 0950US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 1048US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 1147US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 1247US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 1337US9212298B2Adhesive sheet and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Dec 15, 2015·0 cites·9 claims
- 1437US2003069331A1Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor deviceFiled 2001·Application pending·0 cites
- 1525US2012114934A1Bonding sheetKODAMA MEGUMI·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tetsurou Iwakura files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →