Inventor · disambiguated record
Hiroyuki Kuriya
Also filed as: KURIYA HIROYUKI
13 granted patents·6 pending applications·518 citations·filing 1992–2014
94Inventor score
Top patents by PatentIndex Score
19 records- 0197US5449480AMethod of producing boards for printed wiringHITACHI CHEMICAL CO LTD·Filed 1993·Granted Sep 12, 1995·182 cites·20 claims
- 0295US6673441B1Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the sameHITACHI CHEMICAL CO LTD·Filed 2000·Granted Jan 6, 2004·55 cites·23 claims
- 0389US6265782B1Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated filmHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 24, 2001·99 cites·37 claims
- 0488US6838170B2Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the sameHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jan 4, 2005·24 cites·46 claims
- 0585US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0684US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0783US7592250B2Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic deviceHITACHI CHEMICAL CO LTD·Filed 2007·Granted Sep 22, 2009·10 cites·8 claims
- 0882US6621170B2Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Sep 16, 2003·29 cites·29 claims
- 0979US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 1074US7239013B2Multilayer wiring board, method for producing the same, semiconductor device and radio electronic deviceHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jul 3, 2007·16 cites·47 claims
- 1163US7700185B2Insulation material, film, circuit board and method of producing themHITACHI CHEMICAL CO LTD·Filed 2004·Granted Apr 20, 2010·9 cites·49 claims
- 1262US6889431B2Manufacturing method of electronic circuit including multilayer circuit boardHITACHI CHEMICAL CO LTD·Filed 2002·Granted May 10, 2005·11 cites·8 claims
- 1361US5319005AEpoxy resin molding material for sealing of electronic componentHITACHI CHEMICAL CO LTD·Filed 1992·Granted Jun 7, 1994·32 cites·9 claims
- 1457US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1553US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 1650US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 1748US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 1847US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 1937US2003069331A1Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →