Assignee
INADA TEIICHI
JP·2 granted patents·8 pending applications·21 citations·filing 2004–2012
Top patents by PatentIndex Score
10 records- 0194US8617930B2Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2012·Granted Dec 31, 2013·19 cites·13 claims
- 0285US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0353US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 0452US2008171187A1Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2008·Application pending·0 cites
- 0550US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 0648US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 0747US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 0847US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 0943US2011287250A1Adhesive sheet, semiconductor device, and process for producing semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 1040US2006128065A1Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing methodINADA TEIICHI·Filed 2004·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →