Adhesive sheet, semiconductor device, and process for producing semiconductor device

Abstract

An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of −50° C. to 50° C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 μm.

1 . An adhesive sheet comprising:
 100 parts by weight of a resin comprising 15 to 40 wt of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of −50° C. to 50° C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component; and   40 to 180 parts by weight of a filler,   the adhesive sheet having a thickness of 10 to 250 μm.   
     
     
         2 . The adhesive sheet according to  claim 1 , wherein prior to curing, the storage modulus by a dynamic viscoelasticity measurement at 25° C. is 200 to 3,000 MPa, and the storage modulus by a dynamic viscoelasticity measurement at 80° C. is 0.1 to 10 MPa. 
     
     
         3 . The adhesive sheet according to  claim 1 , wherein the storage modulus by a dynamic viscoelasticity measurement at 170° C. subsequent to curing is 20 to 600 MPa. 
     
     
         4 . The adhesive sheet according to  claim 1 , wherein the melt viscosity at 100° C. prior to curing is 1,000 to 7,500 Pa·s. 
     
     
         5 . The adhesive sheet according to  claim 1 , which comprises 100 parts by weight of the resin and 60 to 120 parts by weight of the filler. 
     
     
         6 . The adhesive sheet according to  claim 1 , wherein the filler has a Mohs' hardness of 3 to 8. 
     
     
         7 . The adhesive sheet according to  claim 1 , wherein the filler has an average particle size of 0.05 to 5 μm and a specific surface area of 2 to 200 m 2 /g.