Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device

Abstract

The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

1 . An adhesive sheet having a property that it can be laminated together with dicing tape onto a wafer prior to stealth dicing, and is capable of being subjected to stealth dicing, and which comprises:
 a polymer component, which includes acrylic rubber having a glass transition temperature of −30° to 50° C., and a weight-average molecular weight of 50,000 to 1,000,000; and   a filler,   wherein the breaking strength of the adhesive sheet in a B-stage state is from 0.1 to 10 MPa at 25° C., and the breaking elongation thereof being from 1 to 40% at 25° C.   
     
     
         2 . The adhesive sheet according to  claim 1 ,
 wherein the elastic modulus of the adhesive sheet in a B-stage state is from 1 to 3000 MPa in measurement of the dynamic viscoelasticity at 25° C. and 10 Hz, and the elastic modulus thereof being from 4000 to 20000 MPa in measurement of the dynamic viscoelasticity at 25° C. and 900 Hz.   
     
     
         3 . The adhesive sheet according to  claim 1 ,
 wherein the elastic modulus of the adhesive sheet in a B-stage state is from 1 to 3000 MPa in measurement of the dynamic viscoelasticity at 25° C. and 10 Hz, and the elastic modulus thereof being from 4000 to 20000 MPa in measurement of the dynamic viscoelasticity at −20° C. and 10 Hz.   
     
     
         4 . The adhesive sheet according to  claim 1 ,
 wherein the elastic modulus of the adhesive sheet in a B-stage state is from 0.1 to 20 MPa in measurement of the dynamic viscoelasticity at 60° C. and 10 Hz.   
     
     
         5 . The adhesive sheet according to  claim 1 , wherein the acrylic rubber is contained in an amount of 50% or less of the total weight of the adhesive sheet from which the weight of a filler is removed. 
     
     
         6 . The adhesive sheet according to  claim 1 , wherein the content of remaining volatile matters is from 0.01 to 3% by weight. 
     
     
         7 . The adhesive sheet according to  claim 1 , which has a film thickness of 1 to 250 μm. 
     
     
         8 . The adhesive sheet according to  claim 1 , wherein the filler is contained in an amount of 5 to 70% of the total weight of the adhesive sheet. 
     
     
         9 . The adhesive sheet according to  claim 1 , wherein the filler is contained in an amount of 35% to 60% of the total weight of the adhesive sheet. 
     
     
         10 . The adhesive sheet according to  claim 1 , wherein the acrylic rubber is contained in an amount of 35% or less of the total weight of the adhesive sheet from which the weight of a filler is removed. 
     
     
         11 . The adhesive sheet according to  claim 10 , wherein the acrylic rubber is contained in an amount of from 25% to 35% of the total weight of the adhesive sheet from which the weight of the filler is removed. 
     
     
         12 . The adhesive sheet according to  claim 1 , wherein the polymer component further includes epoxy resin. 
     
     
         13 . The adhesive sheet according to  claim 1 , laminated together with the dicing tape onto the wafer, prior to the stealth dicing.