Inventor · disambiguated record
Youichi Hosokawa
Also filed as: HOSOKAWA YOUICHI
15 granted patents·10 pending applications·55 citations·filing 1998–2016
91Inventor score
Top patents by PatentIndex Score
25 records- 0192US10185165B2Optical waveguide deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2016·Granted Jan 22, 2019·6 cites·6 claims
- 0292US10078253B2Optical modulatorSUMITOMO OSAKA CEMENT CO LTD·Filed 2016·Granted Sep 18, 2018·6 cites·5 claims
- 0388US8909001B2Optical modulatorSUMITOMO OSAKA CEMENT CO LTD·Filed 2013·Granted Dec 9, 2014·6 cites·3 claims
- 0485US10025121B2Optical waveguide element moduleSUMITOMO OSAKA CEMENT CO LTD·Filed 2015·Granted Jul 17, 2018·3 cites·10 claims
- 0585US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0683US9778539B2Optical modulation deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2014·Granted Oct 3, 2017·4 cites·2 claims
- 0783US9250455B2Optical modulatorSUMITOMO OSAKA CEMENT CO LTD·Filed 2013·Granted Feb 2, 2016·4 cites·9 claims
- 0882US9523872B2Optical deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2016·Granted Dec 20, 2016·2 cites·11 claims
- 0980US9977270B2Optical deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2015·Granted May 22, 2018·2 cites·7 claims
- 1079US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 1176US9570879B2Optical pulse-generator and optical pulse-generating methodSUMITOMO OSAKA CEMENT CO LTD·Filed 2013·Granted Feb 14, 2017·3 cites·14 claims
- 1273US10162201B2Optical modulatorSUMITOMO OSAKA CEMENT CO LTD·Filed 2015·Granted Dec 25, 2018·1 cites·5 claims
- 1357US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1453US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 1550US2009022893A1Punched adhesive tape for semicconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameTANABE YOSHIYUKI·Filed 2008·Application pending·0 cites
- 1650US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 1749US6523446B1Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Feb 25, 2003·13 cites·17 claims
- 1849US2016313579A1Electro-optic elementSUMITOMO OSAKA CEMENT CO LTD·Filed 2014·Application pending·0 cites
- 1948US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 2047US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 2147US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 2246US7449076B2Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 2005·Granted Nov 11, 2008·0 cites·2 claims
- 2337US7273654B2Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 25, 2007·0 cites·21 claims
- 2437US2003069331A1Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor deviceFiled 2001·Application pending·0 cites
- 2535US2017012700A1Optical deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →