Punched adhesive tape for semicconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

Abstract

A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

1 . A method for making a punched adhesive tape for fabricating semiconductor devices, comprising:
 providing an adhesive tape comprising a base film and an adhesive layer provided on at least one side of the base film;   inspecting the adhesive tape for at least one of contaminants and defects;   punching at least one hole completely through the base film and the adhesive layer at or in a vicinity of a region at which a contaminant or a defect is detected.   
     
     
         2 . The method for making a punched adhesive tape for fabricating semiconductor devices according to  claim 1 , further comprising winding the adhesive tape having at least one hole punched completely through the base film and the adhesive layer into a roll. 
     
     
         3 . The method for making a punched adhesive tape for fabricating semiconductor devices according to  claim 1 , further comprising winding the adhesive tape before inspecting the adhesive tape, continuously unwinding the adhesive tape while inspecting the adhesive tape, stopping the unwinding when a contaminant or a defect is detected, and punching the at least one hole completely through the base film and the adhesive layer at or in a vicinity of a region at which a contaminant or a defect is detected while the unwinding is stopped.