Inventor · disambiguated record
Hiroshi Kirihara
Also filed as: KIRIHARA HIROSHI
5 granted patents·1 pending application·141 citations·filing 1997–2008
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0189US6265782B1Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated filmHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 24, 2001·99 cites·37 claims
- 0282US6621170B2Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Sep 16, 2003·29 cites·29 claims
- 0350US2009022893A1Punched adhesive tape for semicconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameTANABE YOSHIYUKI·Filed 2008·Application pending·0 cites
- 0449US6523446B1Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Feb 25, 2003·13 cites·17 claims
- 0546US7449076B2Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 2005·Granted Nov 11, 2008·0 cites·2 claims
- 0637US7273654B2Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 25, 2007·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →