Inventor · disambiguated record
Yasushi Shimada
Also filed as: SHIMADA YASUSHI
16 granted patents·7 pending applications·503 citations·filing 1991–2014
95Inventor score
Top patents by PatentIndex Score
23 records- 0195US6673441B1Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the sameHITACHI CHEMICAL CO LTD·Filed 2000·Granted Jan 6, 2004·55 cites·23 claims
- 0289US6265782B1Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated filmHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 24, 2001·99 cites·37 claims
- 0388US6838170B2Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the sameHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jan 4, 2005·24 cites·46 claims
- 0485US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0584US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0683US7592250B2Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic deviceHITACHI CHEMICAL CO LTD·Filed 2007·Granted Sep 22, 2009·10 cites·8 claims
- 0782US6621170B2Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Sep 16, 2003·29 cites·29 claims
- 0880US6184577B1Electronic component parts deviceHITACHI CHEMICAL CO LTD·Filed 1997·Granted Feb 6, 2001·62 cites·8 claims
- 0980US6090468AMultilayer wiring board for mounting semiconductor device and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 18, 2000·63 cites·18 claims
- 1079US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 1175US5965269AAdhesive, adhesive film and adhesive-backed metal foilHITACHI CHEMICAL CO LTD·Filed 1996·Granted Oct 12, 1999·40 cites·26 claims
- 1274US7239013B2Multilayer wiring board, method for producing the same, semiconductor device and radio electronic deviceHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jul 3, 2007·16 cites·47 claims
- 1363US7700185B2Insulation material, film, circuit board and method of producing themHITACHI CHEMICAL CO LTD·Filed 2004·Granted Apr 20, 2010·9 cites·49 claims
- 1462US6889431B2Manufacturing method of electronic circuit including multilayer circuit boardHITACHI CHEMICAL CO LTD·Filed 2002·Granted May 10, 2005·11 cites·8 claims
- 1557US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1655US5233133ACoaxial conductor interconnection wiring boardHITACHI CHEMICAL CO LTD·Filed 1991·Granted Aug 3, 1993·17 cites·2 claims
- 1754US5323534AProcess for producing coaxial conductor interconnection wiring boardHITACHI CHEMICAL CO LTD·Filed 1993·Granted Jun 28, 1994·17 cites·6 claims
- 1853US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 1950US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 2048US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 2147US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 2247US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 2337US2003069331A1Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor deviceFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yasushi Shimada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →