Inventor · disambiguated record
Takayuki Matsuzaki
Also filed as: MATSUZAKI TAKAYUKI
22 granted patents·12 pending applications·261 citations·filing 2001–2018
95Inventor score
Top patents by PatentIndex Score
34 records- 0188US7517724B2Dicing/die bonding sheetHITACHI CHEMICAL CO LTD·Filed 2005·Granted Apr 14, 2009·22 cites·15 claims
- 0287US8470115B2Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2011·Granted Jun 25, 2013·8 cites·3 claims
- 0387US8465615B2Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2011·Granted Jun 18, 2013·8 cites·9 claims
- 0486USD656910SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Apr 3, 2012·38 cites·1 claims
- 0585US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 0684US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0783USD664512SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Jul 31, 2012·27 cites·1 claims
- 0883USD656909SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Apr 3, 2012·28 cites·1 claims
- 0982USD664511SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Jul 31, 2012·26 cites·1 claims
- 1079US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 1178US7457074B2Method and apparatus for correcting errors while writing spiral servo information in a disk driveTOSHIBA KK·Filed 2007·Granted Nov 25, 2008·4 cites·18 claims
- 1277US8975161B2Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing methodKATOU RIE·Filed 2011·Granted Mar 10, 2015·6 cites·10 claims
- 1371USD680505SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Apr 23, 2013·15 cites·1 claims
- 1467USD690278SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Sep 24, 2013·13 cites·1 claims
- 1565US9076832B2Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor deviceTANIGUCHI KOUHEI·Filed 2011·Granted Jul 7, 2015·1 cites·6 claims
- 1659USD689831SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Sep 17, 2013·9 cites·1 claims
- 1757US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1854US2013295314A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1954US2013302570A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 2053US9190309B2Tape for processing wafer, method for manufacturing tape for processingHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 17, 2015·0 cites·5 claims
- 2153US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 2252US9076833B2Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor deviceTANIGUCHI KOUHEI·Filed 2011·Granted Jul 7, 2015·0 cites·5 claims
- 2351US7538965B2Method and apparatus for writing servo management information in a disk driveTOSHIBA KK·Filed 2007·Granted May 26, 2009·0 cites·4 claims
- 2450US2012135176A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2012·Application pending·0 cites
- 2550US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 2648US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 2747US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 2847US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 2946US2008261039A1Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor DeviceTANAKA MAIKO·Filed 2005·Application pending·0 cites
- 3045USD804435SFlap in an adhesive tape for semiconductor manufacturingHITACHI CHEMICAL CO LTD·Filed 2014·Granted Dec 5, 2017·5 cites·1 claims
- 3141US12454612B2Liquid resin composition for compression molding and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 28, 2025·0 cites·10 claims
- 3240US2015179494A1Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 3338US12131970B2Liquid resin composition for sealing and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 29, 2024·0 cites·20 claims
- 3437US2003069331A1Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor deviceFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Takayuki Matsuzaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →