USD690278SActiveUtility

Adhesive tape for semiconductor manufacturing

Assignee: TANIGUCHI KOUHEIPriority: Oct 15, 2010Filed: Feb 16, 2012Granted: Sep 24, 2013
Est. expiryOct 15, 2030(~4.2 yrs left)· nominal 20-yr term from priority
67
PatentIndex Score
13
Cited by
33
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

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