Inventor · disambiguated record
Shinya Katou
Also filed as: KATOU SHINYA
15 granted patents·1 pending application·187 citations·filing 2002–2015
93Inventor score
Top patents by PatentIndex Score
16 records- 0186USD656910SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Apr 3, 2012·38 cites·1 claims
- 0283USD664512SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Jul 31, 2012·27 cites·1 claims
- 0383USD656909SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Apr 3, 2012·28 cites·1 claims
- 0482USD664511SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Jul 31, 2012·26 cites·1 claims
- 0577US8975161B2Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing methodKATOU RIE·Filed 2011·Granted Mar 10, 2015·6 cites·10 claims
- 0674US10233324B2Epoxy resin compositionMITSUBISHI CHEM CORP·Filed 2013·Granted Mar 19, 2019·2 cites·28 claims
- 0771USD680505SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Apr 23, 2013·15 cites·1 claims
- 0867USD690278SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Sep 24, 2013·13 cites·1 claims
- 0966US6806436B2Series spot welding method, device for carrying out the method, and electrodes employed in the method or the deviceTOYOTA AUTO BODY CO LTD·Filed 2002·Granted Oct 19, 2004·15 cites·16 claims
- 1065US9076832B2Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor deviceTANIGUCHI KOUHEI·Filed 2011·Granted Jul 7, 2015·1 cites·6 claims
- 1159USD689831SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Sep 17, 2013·9 cites·1 claims
- 1255US9011624B2Adhesive sheet and method for manufacturing adhesive sheetsFURUTANI RYOJI·Filed 2010·Granted Apr 21, 2015·2 cites·2 claims
- 1353US9190309B2Tape for processing wafer, method for manufacturing tape for processingHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 17, 2015·0 cites·5 claims
- 1452US9076833B2Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor deviceTANIGUCHI KOUHEI·Filed 2011·Granted Jul 7, 2015·0 cites·5 claims
- 1545USD804435SFlap in an adhesive tape for semiconductor manufacturingHITACHI CHEMICAL CO LTD·Filed 2014·Granted Dec 5, 2017·5 cites·1 claims
- 1643US2017369700A1Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using sameMITSUBISHI RAYON CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →