USD664511SActiveUtility

Adhesive tape for semiconductor manufacturing

Assignee: TANIGUCHI KOUHEIPriority: Oct 15, 2010Filed: Apr 15, 2011Granted: Jul 31, 2012
Est. expiryOct 15, 2030(~4.2 yrs left)· nominal 20-yr term from priority
82
PatentIndex Score
26
Cited by
25
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

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