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Flap in an adhesive tape for semiconductor manufacturing

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Assignee: HITACHI CHEMICAL CO LTDPriority: Oct 15, 2010Filed: May 20, 2014Granted: Dec 5, 2017
Est. expiryOct 15, 2030(~4.3 yrs left)· nominal 20-yr term from priority
Inventors:Kouhei TaniguchiTakayuki MatsuzakiShinya KatouKouji KomoridaMichio MashinoTatsuya SakutaRie Katou
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PatentIndex Score
5
Cited by
37
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a flap in an adhesive tape for semiconductor manufacturing, as shown and described.

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