Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Abstract

An adhesive sheet comprising a release substrate 10 , a substrate film 14 , and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14 , wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10 , and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.

1 . A die bond dicing sheet comprising a release substrate, a substrate film, a first tacky-adhesive layer placed between the release substrate and the substrate film, and a second tacky-adhesive layer placed between at least a part of a peripheral part of the first tacky-adhesive layer and the release substrate, wherein:
 an annular incision is formed from the first tacky-adhesive layer side in the release substrate, the first tacky-adhesive layer is laminated so as to cover the whole inner surface of the incision in the release substrate, and   the incision has a depth of less than the thickness of the release substrate and 25 μm or less.   
     
     
         2 . The die bond dicing sheet of  claim 1 , wherein the second tacky-adhesive layer has tackiness to an adherend to which the second tacky-adhesive layer is stuck after the release substrate is peeled off. 
     
     
         3 . The die bond dicing sheet of  claim 1 , which further comprises an intermediate layer placed between at least a part of the peripheral part of the first tacky-adhesive layer and the second tacky-adhesive layer. 
     
     
         4 . The die bond dicing sheet of  claim 2 , wherein the second tacky-adhesive layer has a tackiness to the first tacky-adhesive layer. 
     
     
         5 . The die bond dicing sheet of  claim 1 , wherein the second tacky-adhesive layer is a separate layer from the first tacky-adhesive layer. 
     
     
         6 . The die bond dicing sheet of  claim 1 , wherein the second tacky-adhesive layer is made of a different material than that of the first tacky-adhesive layer. 
     
     
         7 . The die bond dicing sheet of  claim 1 , wherein the second tacky-adhesive layer is placed only between a peripheral part of the first tacky-adhesive layer and the release substrate.