Assignee
HEBERT FRANCOIS
US·32 granted patents·9 pending applications·221 citations·filing 1985–2017
Top patents by PatentIndex Score
41 records- 0195US8168496B2Single die output power stage using trench-gate low-side and LDMOS high-side MOSFETS, structure and methodHEBERT FRANCOIS·Filed 2009·Granted May 1, 2012·17 cites·21 claims
- 0294US8062932B2Compact semiconductor package with integrated bypass capacitor and methodHEBERT FRANCOIS·Filed 2008·Granted Nov 22, 2011·30 cites·4 claims
- 0393US8637360B2Power devices with integrated protection devices: structures and methodsHEBERT FRANCOIS·Filed 2010·Granted Jan 28, 2014·14 cites·10 claims
- 0492US8304312B2Charged balanced devices with shielded gate trenchHEBERT FRANCOIS·Filed 2011·Granted Nov 6, 2012·12 cites·9 claims
- 0592US8198154B2Method of forming bottom-drain LDMOS power MOSFET structure having a top drain strapHEBERT FRANCOIS·Filed 2010·Granted Jun 12, 2012·14 cites·20 claims
- 0691US8492773B2Power devices with integrated protection devices: structures and methodsHEBERT FRANCOIS·Filed 2010·Granted Jul 23, 2013·12 cites·10 claims
- 0791US8242510B2Monolithic integration of gallium nitride and silicon devices and circuits, structure and methodHEBERT FRANCOIS·Filed 2010·Granted Aug 14, 2012·11 cites·32 claims
- 0890US8227315B2Inverted-trench grounded-source FET structure using conductive substrates, with highly doped substratesHEBERT FRANCOIS·Filed 2011·Granted Jul 24, 2012·7 cites·14 claims
- 0989US9524957B2Back-to-back stacked diesHEBERT FRANCOIS·Filed 2012·Granted Dec 20, 2016·12 cites·11 claims
- 1089US8168490B2Co-packaging approach for power converters based on planar devices, structure and methodHEBERT FRANCOIS·Filed 2009·Granted May 1, 2012·8 cites·7 claims
- 1188US8058960B2Chip scale power converter package having an inductor substrateHEBERT FRANCOIS·Filed 2007·Granted Nov 15, 2011·20 cites·36 claims
- 1287US8330200B2Super-self-aligned trench-DMOS structure and methodHEBERT FRANCOIS·Filed 2010·Granted Dec 11, 2012·6 cites·5 claims
- 1385US8148256B2Copper bonding methodHEBERT FRANCOIS·Filed 2009·Granted Apr 3, 2012·9 cites·17 claims
- 1480US8637907B2Optical sensors for detecting relative motion and/or position and methods and systems for using such optical sensorsHEBERT FRANCOIS·Filed 2012·Granted Jan 28, 2014·4 cites·15 claims
- 1580US8502312B2Configurations and methods for manufacturing charge balanced devicesHEBERT FRANCOIS·Filed 2010·Granted Aug 6, 2013·4 cites·10 claims
- 1679US9209173B2Single die output power stage using trench-gate low-side and LDMOS high-side MOSFETS, structure and methodHEBERT FRANCOIS·Filed 2012·Granted Dec 8, 2015·2 cites·20 claims
- 1779US8148817B2Multi-die DC-DC buck power converter with efficient packagingHEBERT FRANCOIS·Filed 2010·Granted Apr 3, 2012·4 cites·8 claims
- 1879US8110472B2High power and high temperature semiconductor power devices protected by non-uniform ballasted sourcesHEBERT FRANCOIS·Filed 2011·Granted Feb 7, 2012·4 cites·19 claims
- 1974US8183662B2Compact semiconductor package with integrated bypass capacitorHEBERT FRANCOIS·Filed 2011·Granted May 22, 2012·3 cites·16 claims
- 2072US8283243B2Bottom anode schottky diode structure and methodHEBERT FRANCOIS·Filed 2011·Granted Oct 9, 2012·2 cites·5 claims
- 2171US8461004B2Configuration of high-voltage semiconductor power device to achieve three dimensional charge couplingHEBERT FRANCOIS·Filed 2011·Granted Jun 11, 2013·2 cites·3 claims
- 2271US8168486B2Methods for manufacturing enhancement-mode HEMTs with self-aligned field plateHEBERT FRANCOIS·Filed 2010·Granted May 1, 2012·3 cites·44 claims
- 2370US8441109B2Structure and method for self protection of power device with expanded voltage rangesHEBERT FRANCOIS·Filed 2008·Granted May 14, 2013·4 cites·25 claims
- 2469US8455320B2Inverted-trench grounded-source FET structure using conductive substrates, with highly doped substratesHEBERT FRANCOIS·Filed 2012·Granted Jun 4, 2013·1 cites·19 claims
- 2569US8222694B2True CSP power MOSFET based on bottom-source LDMOSHEBERT FRANCOIS·Filed 2010·Granted Jul 17, 2012·2 cites·24 claims
- 2666US8058961B2Lead frame-based discrete power inductorHEBERT FRANCOIS·Filed 2011·Granted Nov 15, 2011·1 cites·5 claims
- 2758US10468526B2Self-aligned slotted accumulation-mode field effect transistor (ACCUFET) structure and methodHEBERT FRANCOIS·Filed 2017·Granted Nov 5, 2019·0 cites·9 claims
- 2856US2012178211A1Co-packaging approach for power converters based on planar devices, structure and methodHEBERT FRANCOIS·Filed 2012·Application pending·0 cites
- 2952US4654687AHigh frequency bipolar transistor structuresHEBERT FRANCOIS·Filed 1985·Granted Mar 31, 1987·13 cites·14 claims
- 3052US2012313201A1Optical sensor devices including front-end-of-line (feol) optical filters and methods for fabricating optical sensor devicesHEBERT FRANCOIS·Filed 2012·Application pending·0 cites
- 3151US8264084B2Solder-top enhanced semiconductor device for low parasitic impedance packagingHEBERT FRANCOIS·Filed 2007·Granted Sep 11, 2012·0 cites·11 claims
- 3250US8497160B2Method for making solder-top enhanced semiconductor device of low parasitic packaging impedanceHEBERT FRANCOIS·Filed 2012·Granted Jul 30, 2013·0 cites·14 claims
- 3350US7598620B2Copper bonding compatible bond pad structure and methodHEBERT FRANCOIS·Filed 2006·Granted Oct 6, 2009·0 cites·19 claims
- 3448US2010276701A1Low thermal resistance and robust chip-scale-package (csp), structure and methodHEBERT FRANCOIS·Filed 2009·Application pending·0 cites
- 3546US2011212577A1Semiconductor power device having a stacked discrete inductor structureHEBERT FRANCOIS·Filed 2010·Application pending·0 cites
- 3639US8193583B2Monolithic output stage with vertical high-side PMOS and vertical low-side NMOS interconnected using buried metal, structure and methodHEBERT FRANCOIS·Filed 2010·Granted Jun 5, 2012·0 cites·24 claims
- 3739US2012256193A1Monolithic integrated capacitors for high-efficiency power convertersHEBERT FRANCOIS·Filed 2011·Application pending·0 cites
- 3839US2012098090A1High-efficiency power converters with integrated capacitorsHEBERT FRANCOIS·Filed 2011·Application pending·0 cites
- 3938US2011115047A1Semiconductor process using mask openings of varying widths to form two or more device structuresHEBERT FRANCOIS·Filed 2010·Application pending·0 cites
- 4037US2012007097A1Schottky diode with combined field plate and guard ringHEBERT FRANCOIS·Filed 2010·Application pending·0 cites
- 4135US2011121387A1Integrated guarded schottky diode compatible with trench-gate dmos, structure and methodHEBERT FRANCOIS·Filed 2010·Application pending·0 cites
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