Assignee
HEMBREE DAVID R
US·4 granted patents·2 pending applications·21 citations·filing 2005–2012
Top patents by PatentIndex Score
6 records- 0190US8217510B2Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)HEMBREE DAVID R·Filed 2011·Granted Jul 10, 2012·7 cites·20 claims
- 0290US8120167B2System with semiconductor components having encapsulated through wire interconnects (TWI)HEMBREE DAVID R·Filed 2010·Granted Feb 21, 2012·8 cites·20 claims
- 0389US8404523B2Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)HEMBREE DAVID R·Filed 2012·Granted Mar 26, 2013·6 cites·20 claims
- 0451US8982469B2Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the sameHEMBREE DAVID R·Filed 2011·Granted Mar 17, 2015·0 cites·5 claims
- 0544US2006081583A1Method and process of contact to a heat softened solder ball arrayHEMBREE DAVID R·Filed 2005·Application pending·0 cites
- 0644US2007200575A1Circuit and method for error test, recordation, and repairHEMBREE DAVID R·Filed 2007·Application pending·0 cites
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