Assignee
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD
JP·8 granted patents·7 citations·filing 2013–2018
Top patents by PatentIndex Score
8 records- 0182US11487201B2Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic componentHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2018·Granted Nov 1, 2022·3 cites·14 claims
- 0267US10725379B2Polymide precursor resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2013·Granted Jul 28, 2020·1 cites·10 claims
- 0364US11226560B2Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic componentHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2018·Granted Jan 18, 2022·2 cites·13 claims
- 0457US9751984B2Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2013·Granted Sep 5, 2017·1 cites·13 claims
- 0547US11021572B2Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic componentHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2017·Granted Jun 1, 2021·0 cites·7 claims
- 0636US11592743B2Positive-type photosensitive resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2016·Granted Feb 28, 2023·0 cites·10 claims
- 0734US11048167B2Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic componentHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2016·Granted Jun 29, 2021·0 cites·9 claims
- 0831US11592744B2Positive-type photosensitive resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2016·Granted Feb 28, 2023·0 cites·10 claims
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