Polymide precursor resin composition

Abstract

A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R 1 is a tetravalent organic group, R 2 is a divalent organic group and R 3 and R 4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R 5 is an alkyl group having 1 to 4 carbon atoms, R 6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R 7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R 8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R 9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R 8 and R 9 may independently have a substituent.

The invention claimed is: 
     
       1. A negative-type photosensitive resin composition comprising the following components (a) to (C):
 (a) a polyimide precursor having a structural unit represented by the following general formula (1); 
 (b) a compound represented by the following general formula (2); and 
 (c) a compound that generates a radical upon irradiation with active rays: 
 
       
         
           
           
               
               
           
         
         wherein in the formula, R 1  is a tetravalent organic group, R 2  is a divalent organic group, R 3  and R 4  are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond, and at least one of R 3  and R 4  is an acryloxyalkyl group having 1 to 10 carbon atoms or a methacryloxyalkyl group having 1 to 10 carbon atoms; 
       
       
         
           
           
               
               
           
         
         wherein in the formula, R 5  is an alkyl group having 1 to 4 carbon atoms, R 6  is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R 7  is a group represented by the following general formula (3) or (4); 
       
       
         
           
           
               
               
           
         
         wherein in the formulas, R 8  is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R 9  is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R 8  and R 9  may independently have a substituent, and 
         wherein the component (b) is at least one of the following compounds: 
       
       
         
           
           
               
               
           
         
         wherein upon irradiation, an irradiated portion of the compound becomes insoluble and forms a negative image. 
       
     
     
       2. The resin composition according to  claim 1 , wherein R 2  in the general formula (1) is a divalent organic group represented by the following general formula (5): 
       
         
           
           
               
               
           
         
         wherein in the formula, R 10  to R 17  are independently a hydrogen atom, a fluorine atom or a monovalent organic group, and at least one of R 10  to R 17  is a fluorine atom or a trifluoromethyl group. 
       
     
     
       3. The resin composition according to  claim 1 , wherein R 2  in the general formula (1) is a divalent organic group represented by the general formula (6): 
       
         
           
           
               
               
           
         
         wherein in the formula, R 18  and R 19  are independently a fluorine atom or a trifluoromethyl group. 
       
     
     
       4. The resin composition according to  claim 1 , wherein the component (c) is an oxime ester compound. 
     
     
       5. A cured film formed from the resin composition according to  claim 1 . 
     
     
       6. A method for producing a cured film, the method comprising the steps of:
 applying to a substrate the resin composition according to  claim 1 , followed by drying, thereby to form a coating film; and 
 subjecting the coating film to a heat treatment. 
 
     
     
       7. A patterned cured film formed from the resin composition according to  claim 1 . 
     
     
       8. A method for producing a patterned cured film, the method comprising the steps of:
 applying the resin composition according to  claim 1  to a substrate, followed by drying, thereby to form a coating film; 
 irradiating the coating film with active rays, followed by development, thereby to form a patterned resin film; and 
 subjecting the patterned resin film to a heat treatment. 
 
     
     
       9. The resin composition according to  claim 1 , wherein the component (c) is an oxime organic ester. 
     
     
       10. The method according to  claim 8 , wherein the component (c) is an oxime organic ester.